OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for ISO 26262, IEC 61508, EN 50128
Users Deploy EC-FPGA Formal Sequential Equivalence Checking into Automotive ASIL D Projects with no Additional Tool Qualification Requirements
MUNICH and SAN JOSE, CALIF. – February 14, 2018 – OneSpin® Solutions, provider of innovative formal verification solutions for highly reliable, digital integrated circuits (ICs), announced immediate availability of its OneSpin 360 ECFPGA ™ Tool Qualification Kit certified by internationally-recognized testing body TÜV SÜD. The certification states that EC-FPGA meets the most stringent tool qualification criteria set by functional safety standards ISO 26262 (TCL3/ASIL D), IEC 61508 (T2/SIL 3) and EN 50128 (T2/SIL 3).
“OneSpin’s EC-FPGA is the only EDA tool to exhaustively verify highly optimized FPGAs for autonomous vehicles, aerospace, nuclear power plants, railways and medical devices to eliminate systematic errors introduced during implementation,” notes Dr. Raik Brinkmann, OneSpin’s president and CEO. “With this certified Tool Qualification Kit, our users can deploy EC-FPGA seamlessly in their safety-critical flows to achieve a new level of productivity and standard compliance.”
EC-FPGA is an automatic sequential equivalence checker that prevents fieldprogrammable gate array (FPGA) design flows from introducing synthesis, place-androute and other implementation errors. Safety standards require rigorous verification before production to minimize the risk of failures in the field. Using advanced formal technology, EC-FPGA detects corner-case design flow bugs with a process that is orders of magnitude more efficient and rigorous than gate-level simulation.
OneSpin also announced today that its general tool development and testing process has been audited by TÜV SÜD. (For more details, see accompanying news release dated February 14: "OneSpin Completes Series of Factory Inspections, Audits by Internationally-Recognized Testing Body TÜV SÜD.") Additional Tool Qualification Kits for other OneSpin tools will be available later in the year.
Availability and Pricing
OneSpin 360 EC-FPGA Tool Qualification Kit is shipping now. Pricing is available upon request. OneSpin has direct sales channels in the United States, Europe and throughout Asia, backed by a variety of customer service and support options including on-site training, hotline support and consulting services.
To learn more about the OneSpin 360 EC-FPGA Tool Qualification Kit, visit onespin.com/tuv.
|
Related News
- ARM Accelerates Time to Market for Safety Certified Applications
- Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow
- IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
- IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
- eMemory IP Garners Most Stringent Level of Certification for Automotive Applications
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |