GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis' Ultra-low Power MCU Reference Design
Co-developed technology solution enables significant power and die size reductions for IoT and wearable products
Santa Clara, Calif., February 27, 2018 – GLOBALFOUNDRIES and eVaderis today announced that they are co-developing an ultra-low power microcontroller (MCU) reference design using GF’s embedded magnetoresistive non-volatile memory (eMRAM) technology on the 22nm FD-SOI (22FDX®) platform. By bringing together the superior reliability and versatility of GF’s 22FDX eMRAM and eVaderis’ ultra-low power IP, the companies will deliver a technology solution that supports a broad set of applications such as battery-powered IoT products, consumer and industrial microcontrollers, and automotive controllers.
eVaderis designed their MCU to leverage the efficient power management capabilities of the 22FDX platform, achieving more than 10 times the battery life and a significantly reduced die size compared to previous generation MCUs. The technology, developed through GF’s FDXcelerator™ Partner Program, will help designers push performance density and flexibility to new levels to achieve a more compact, cost-effective single-chip solution for power-sensitive applications.
“The innovative architecture of eVaderis’ ultra-low power MCU IP, designed around GF’s 22FDX eMRAM technology, is well suited for normally-off IoT applications,” said Jean-Pascal Bost, President and CEO of eVaderis. “Utilizing GF’s eMRAM as a working memory allows sections of the eVaderis MCU to power cycle frequently, without incurring the typical MCU performance penalty. eVaderis looks forward to making this silicon-proven IP available to our customers by the end of this year.”
“Wearable and IoT devices require long-lasting battery life, increased processing capability, and the integration of advanced sensors,” said Dave Eggleston, VP of Embedded Memory at GF. “As an FDXcelerator partner, eVaderis is developing an optimized MCU architecture in GF’s 22FDX with eMRAM that helps customers meet demanding requirements.”
The jointly developed reference design with GF’s 22FDX with eMRAM will be available in Q4 2018. Process design kits for 22FDX with eMRAM and RF solutions are available now. Customer prototyping of 22FDX eMRAM on multi-project wafers (MPWs) is underway, with risk production planned for 2018. Off-the-shelf eMRAM macros are available now, featuring easy design-in with both eFlash and SRAM interface options.
Customers that are interested in learning more about GF’s 22FDX with eMRAM solution, co-developed in partnership with Everspin Technologies, contact your sales representative or visit globalfoundries.com.
About eVaderis
Founded in 2014, eVaderis is the first company worldwide to offer innovative IP solutions based on new, disruptive embedded memory technologies including MRAM and RRAM. The company provides highly competitive products and design services to meet the challenges of producing advanced non-volatile memories, compilers, logic libraries and processor subsystems, paving the way for new chip design paradigms. eVaderis is a member of GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. For more information about the company and its products, please visit www.evaderis.com.
About GF
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit http://www.globalfoundries.com.
|
Related News
- EnSilica develops sureCore's new, Ultra-Low Power IoT reference platform
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
- GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
- Ambiq Micro's Ultra-Low Power Apollo Platform Selected by Fossil Group for its Hybrid Smartwatches
- ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC's Ultra-Low Power Technology Platform
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |