Mobiveil Joins Gen-Z Consortium
Will Actively Participate in Planning New Scalable Computing Interconnect, Protocol
MILPITAS, CALIF. –– March 20, 2018 –– Mobiveil, Inc. today became a member of the Gen-Z Consortium, an organization developing an open systems interconnect designed to provide high-speed, low latency, memory-semantic access to data and devices. “The Gen-Z Consortium’s mission for a memory-centric, standards-based approach aligns with Mobiveil’s views,” remarks Ravi Thummarukudy, chief executive officer of Mobiveil, a fast growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services. “We are pleased to be part of an initiative dedicated to building open systems interconnect for memory semantic access and expect to be an active member.”
Founded in 2016, the Gen-Z Consortium is enabling the industry by developing a new, scalable computing interconnect and protocol. The Gen-Z Core Specification 1.0 enhances existing solution architectures and enables new solution architectures, delivering new levels of performance, software efficiency, power optimizations, security and agility.
“The addition of Mobiveil brings a welcome and meaningful perspective to the Gen-Z Consortium as we continue developing our technology specifications,” says Kurtis Bowman, president of the Gen-Z Consortium. “With a reputation of building re-useable Silicon IP blocks and platforms to accelerate product development, Mobiveil’s involvement will further the Consortium’s goal of creating a next generation interconnect that will bridge existing solutions while enabling new unbounded innovation.”
About Mobiveil, Inc.
Mobiveil is a fast‐growing technology company that specializes in the development of Silicon Intellectual Property (SIP), platforms and solutions for Storage, IoT and Communications markets. It leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect SIP cores, and custom and standard form factor hardware boards to leading semiconductor companies worldwide. For the PCI Express-based Flash Storage market, Mobiveil developed NVMStor™, a subsystem comprised of GPEX™, the PCI Express Controller, NVM Express Controller (UNEX™), Universal Memory Controller (UMMC™) and a Flash Memory Controller. Mobiveil is headquartered in Milpitas, Calif., with engineering development centers located in Chennai, Bangalore and Hyderabad, India, and sales offices and representatives located in U.S., Europe, Israel, Japan, Taiwan and China.
About Gen-Z Consortium
Gen-Z is an open systems interconnect designed to provide memory semantic access to data and devices via direct-attached, switched or fabric topologies. The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The Consortium’s 12 initial members were; AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx with that list expanding as reflected on our Member List.
The Gen-Z Consortium strongly believes in developing an open ecosystem where members, the broader industry, and customers can work together to deliver robust, high-quality specifications that meet solution needs. The Gen-Z Consortium will periodically publicly post draft specifications and technical concepts to elicit input from the broader industry and directly from customers. For more information visit www.genzconsortium.org.
|
Mobiveil Hot IP
Related News
- OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement
- CXL Consortium and Gen-Z Consortium Announce MOU Agreement
- Gen-Z Consortium Announces the Public Release of its Core Specification 1.0
- Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
- BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |