Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
Agreement provides access to DPA Countermeasures portfolio to protect against side-channel attacks
SUNNYVALE, California – March 20, 2018 – Rambus Inc. (NASDAQ: RMBS) today announced that it has signed a patent license agreement with Beijing Tongfang Microelectronics Co., Ltd., a fabless chip design company focusing on smart cards and related technologies. The agreement includes the use of Rambus patents such as Differential Power Analysis (DPA) Countermeasures, which protect devices and integrated circuits against DPA and other related side-channel attacks. Specific terms of the agreement are confidential.
“We are excited to deliver critical technology for protecting sensitive keys and data to Beijing Tongfang Microelectronics Co., Ltd.,” said Bret Sewell, senior vice president and general manager of the Rambus Security Division.
Developed by Rambus Cryptography Research, DPA countermeasures incorporate extensive software, hardware and protocol techniques that protect devices from side-channel attacks, which are implemented in tamper-resistant products used in various applications. For more information on DPA Countermeasures, visit www.rambus.com/security/dpa-countermeasures/.
|
Related News
- Rambus Signs License Agreement with Idaho Scientific
- Rambus Renews License Agreement with Thales
- Rambus Cryptography Research Signs Licensing Agreement with The Athena Group to Accelerate Adoption of DPA Countermeasures
- Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
- Rambus Signs License Agreement with Western Digital
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |