Intel Delays 10nm Volume Production Until 2019
Dylan McGrath, EETimes
4/27/2018 00:01 AM EDT
SAN FRANCISCO — Intel announced the appointment of yet another big name chip architect and provided more evidence that its multi-year quest to diversify beyond the PC is finally paying dividends. But the company also pushed volume production of 10nm chips from late this year to next year, saying progress in improving yields is slower than expected.
In a conference call with analysts following its first quarter earnings announcement, Intel CEO Brian Krzanich said Intel is shipping 10nm products in low volumes and that yields are improving, but that the rate of improvement is slower than the company expected.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
- Delay in Mass Production of New Intel Products a Boon for AMD, Proportion of AMD x86 Server CPUs Forecast to Exceed 22% in 2023, Says TrendForce
- Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production
- BrainChip Begins Volume Production of Akida AI Processor
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards