Samsung Electronics Partners with Avnet ASIC Israel to Strengthen Customer Support at the Forefront of ASIC Design Services
Customers can benefit from fast and reliable go-to-market support with innovative ASIC design solutions based on most advanced silicon process technologies
Frankfurt am Main, GERMANY – May 2, 2018 – Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and Avnet ASIC Israel Ltd. (AAI), a leading provider of ASIC and System on Chip (SoC) design solutions and turn-key design services, today announced a strong partnership in the fields of ASIC design and manufacturing services. This collaboration will allow customers to benefit from innovative ASIC design solutions implemented with most advanced process technologies and a wide portfolio of silicon-proven IPs.
Last January, Samsung launched the Samsung Advanced Foundry Ecosystem (SAFETM) ensuring deep collaboration between Samsung Foundry, ecosystem partners, and customers to deliver competitive and robust SoC designs. As a Design Service Partner (DSP), AAI is participating in Samsung's SAFETM program and will closely collaborate with Samsung to provide dedicated and flexible technical solutions to meet variety needs from a wide range of customers.
With AAI’s managing design activities and supply chain logistics, customers will benefit from easy access to most advanced process technology, competitive pricing, a variety of silicon proven IPs, and committed resources for their ASIC and SoC design success.
“We are very excited to announce AAI as Samsung Foundry's Design Service Partner”, said Axel Fischer, vice president of EMEA Foundry Business at Samsung Semiconductor Europe. “As a Samsung's foundry ecosystem partner, AAI will benefit from access to our most advanced silicon technologies and extensive IP portfolio. Samsung's market leading silicon technology and manufacturing capacity combined with AAI's design expertise will help design teams of system, ASIC, fabless and start-up companies to accelerate the process of reliably bringing their innovations to market.”
“AAI has been supporting the ASIC market community for more than 30 years with hundreds of first time successful projects by proposing our innovative design capability and flexible business models," said Nadav Ben-Ezer, Managing Director of Avnet ASIC Israel. "Leveraging our design-foundry partnership, customers can focus on their innovative ideas and achieve their design goals, while we help them to deliver a fully packaged, tested and verified device to the market smaller, faster, safer and ahead of their competitors."
For more information about Samsung Foundry, please visit http://www.samsungfoundry.com
For more information about Avnet ASIC Israel, please visit http://www.avnet-asic.com
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com
About Samsung Semiconductor Europe
Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co. Ltd., is headquartered in Eschborn near Frankfurt/Main, Germany and operates offices all over Europe, Middle East & Africa (EMEA). The European headquarter is handling the marketing and sales activities of Samsung Electronics' component business units including Memory, System LSI, Foundry, LED and Display business in EMEA. For more information, please visit www.samsung.com/semiconductor.
|
Related News
- Avnet ASIC Israel and Elliptic Partner to Offer Security Solutions to Israeli Customer
- eASIC and Avnet ASIC Israel (AAI) Partner to Support Increasing Demand for Structured ASICs in Israel
- eASIC Partners with Premier Technical Sales to Enhance its Customer Sales and Support for Nextreme Structured ASIC in North America
- Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021
- Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |