Arm Physical IP to Accelerate Mainstream Mobile and IoT SoC Designs on TSMC 22nm ULP/ULL Platform
SAN JOSE, Calif. – May 01, 2018 -- Arm announced today its Arm® Artisan® physical IP will be used in TSMC’s 22nm ultra-low power (ULP) and ultra-low leakage (ULL) platform for Arm-based SoCs. TSMC 22nm ULP/ULL is optimized for mainstream mobile and IoT devices, enabling improved performance for Arm-based SoCs, and reductions in both power and area when compared to the previous-generation TSMC 28nm HPC+ platform.
“This next-generation process technology addresses more functionality using less power and at a smaller area size,” said Gus Yeung, general manager, physical design group, Arm. "The combination of Artisan Physical IP and the design and manufacturing cost advantages of TSMC’s 22nm ULP/ULL platform will provide our mutual partners with immediate compute performance-per-milliwatt and area benefits.”
Artisan physical IP for TSMC 22nm ULP and ULL process technologies includes foundry-sponsored memory compilers optimized for the low-leakage and low-power requirements of next-generation edge computing devices. Complementary to those compilers are ultra-high-density and high-performance physical IP standard cell libraries including power-management kits, and thick-gate oxide cells to help optimize low-leakage power. General Purpose I/O solutions are also offered to ensure maximum performance, power and area (PPA) optimization.
“Artisan Physical IP enables TSMC to accelerate tape-out timelines and bring leading SoCs to market faster for mainstream IoT and mobile devices,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Building on our successful 28nm HPC+ platform collaboration, TSMC and Arm are delivering significant power and area reductions, giving our mutual silicon partners opportunities to enable an improved edge compute experience across more devices.”
Arm's physical IP is a trusted, widely used solution with more than 10 billion integrated circuits (ICs) shipped by Arm partners every year. The aggressive integration schedule of TSMC 22nm ULP and ULL process technologies is on-track for Arm and TSMC silicon partners targeting 2H 2018 tape-outs.
About Arm
Arm technology is at the heart of a computing and connectivity revolution that is transforming the way people live and businesses operate. Our advanced, energy-efficient processor designs are enabling the intelligence in more than 125 billion silicon chips and securely powering products from the sensor to the smartphone to the supercomputer. With more than 1,000 technology partners, including the world's largest consumer brands, we are driving Arm innovation into all areas compute is happening inside the chip, the network and the cloud.
|
Arm Ltd Hot IP
Related News
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
- Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
- SEMIFIVE collaborates with Arm to accelerate its custom SoC designs
Breaking News
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
Most Popular
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
- Xiphera and Crypto Quantique Announce Partnership for Quantum-Resilient Hardware Trust Engines
- Arm's power play will backfire
- Alchip Announces Successful 2nm Test Chip Tapeout
- Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs
E-mail This Article | Printer-Friendly Page |