Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales
Brings IoT, security, identity, IP and semiconductor experience gained at international leaders such as Broadcom, BT
SUNNYVALE, Calif., United States and EINDHOVEN, The Netherlands, June 19, 2018 – Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security and embedded applications, today announced the appointment of Kumi Thiruchelvam as vice president, Europe & Asia Sales. He reports to Chief Executive Officer Pim Tuyls.
“Kumi’s accomplishments across a diverse collection of technologies and markets – digital identity, biometric authentication, cybersecurity – bring a new dimension to our market expansion efforts,” Tuyls said. “I expect his background and insights will contribute to greater traction in Europe and an expanding presence in Greater China.”
“The almost exponential increase in cyber threats and the growing market acceptance of Intrinsic ID’s security technology makes this an opportune time for the company,” Thiruchelvam said. “The BROADKEY and QUIDDIKEY products deliver a hardware-based root-of-trust security that today’s IoT ecosystem requires if they are to meet the expectations that consumers and enterprises have for unclonable security, privacy and data protection.”
Thiruchelvam’s earlier roles include an assignment at Broadcom as senior director, Strategic Business Development; at BT as vice president, Business Development; as vice president, Global Accounts with cellular IP supplier TTPCom; serving as founding CEO of digital identity API-enablement middleware provider WSO2.Telco; and a posting as vice president for Europe & Asia Pacific with Tieto.
He holds a Master of Electronic & Electrical Engineering degree from the University of Leeds, studied at the London Business School, holds Chartered Engineer (CEng) status and is a Member of the Institution of Engineering & Technology (MIET).
About Intrinsic ID
Intrinsic ID is the world’s leading digital authentication company, providing the Internet of Things with hardware-based root-of-trust security via unclonable identities for any IoT-connected device. Based on Intrinsic ID’s patented SRAM PUF technology, the company’s security solutions can be implemented in hardware or software. Intrinsic ID security, which can be deployed at any stage of a product’s lifecycle, is used to validate payment systems, secure connectivity, authenticate sensors, and protect sensitive government and military systems. Intrinsic ID technology has been deployed in more than 100 million devices. Award recognition includes the Frost & Sullivan Technology Leadership Award and the EU Innovation Radar Prize. Intrinsic ID security has been proven in millions of devices certified by Common Criteria, EMVCo, Visa and multiple governments. Intrinsic ID’s mission: “Authenticate Everything.” Visit Intrinsic ID online at www.Intrinsic-ID.com.
|
Related News
- oViCs names Jess Herrera as Vice President of Worldwide Sales & Marketing
- Lattice Semiconductor Names Mark Wadlington Corporate Vice President of World Wide Sales
- Sonics Names Mark McMillan as Vice President of Worldwide Sales
- Intrinsic-ID names Tim Smith as Vice President of Sales in North America
- Elliptic Semiconductor Names Stephen Yee as Vice President, Sales
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |