Tower Semiconductor Chooses Virage Logic ASAP Embedded Memories and STAR Memory System
Multi-year Licensing Agreement Includes High-Speed (HS) And High-Density (HD) Memories
FREMONT, Calif., Dec. 4 /PRNewswire-FirstCall/ -- Virage Logic Corp. (Nasdaq: VIRL - News), a global leader in application-optimized semiconductor IP platforms, announced today that Tower Semiconductor (Nasdaq: TSEM; TASE: TSEM) has licensed several Virage Logic embedded memories as part of a multi-year licensing agreement. Products included are Virage Logic's Area, Speed and Power (ASAP) Memory(TM) High-Speed (HS) and High-Density (HD) embedded SRAM memories, the ASAP ROM, the 2-Port Register file, and the 512Kb and 4Mb Self-Test and Repair (STAR) Memory System(TM). Under the terms of the agreement, Virage Logic developed and licensed the ASAP embedded memories and the STAR Memory System to Tower and its customers for use on Tower's industry standard 0.18-micron process technology. Tower Semiconductor is a pure-play independent CMOS wafer foundry strategically focused on advanced embedded non-volatile memory, digital and mixed-signal CMOS, and CMOS image-sensor technologies.
Tower Semiconductor chose Virage Logic embedded memories because they combine area-efficiency with performance in a design that is silicon proven and cost-effective. Tower has successfully fabricated the Virage Logic single port memories in silicon with high yields in their new Fab 2. By choosing Virage Logic ASAP HD and HS embedded memories, and the STAR Memory System, Tower Semiconductor can offer its customers the memory characteristics that best suit their design requirements, for instance, high-speed memory for networking and communications products, or high-density memory for space- optimized products such as set-top boxes and automotive devices.
"We're pleased to expand our ongoing relationship with Virage Logic by including the ASAP embedded memories and the STAR Memory System in our expanding portfolio of IP, libraries and design support, enabling customers easy utilization of our various foundry technologies," said Sergio Kusevitzky, senior director of IP and design services, Tower Semiconductor. "With the addition of the ASAP embedded memories and the STAR Memory System, we can effectively meet the needs of our customer's particular application."
"The combination of Tower Semiconductor's specialized silicon technologies with Virage Logic's application-optimized memory products offers a powerful synergy for IP suppliers and Foundry Service companies," said Krishna Balachandran, director of product marketing, Virage Logic. "Our ongoing relationship with Tower Semiconductor will help companies bring innovative system-on-chip (SoC) products to market with unprecedented speed and cost- effectiveness."
Virage Logic ASAP and STAR Memory System
Virage Logic memories are developed using embedded memory design techniques that achieve unprecedented results in yield, area, speed, and power. Tower Semiconductor has licensed two types of ASAP memories with specialized characteristics, as well as two densities. Two memories in the STAR Memory System have also been licensed:
- High-Density (HD): Superior for high-volume applications, HD is optimized for area. HD is available as Single Port SRAM, Dual Port SRAM, 1-Port Register File, 2-Port Register File, and ROM.
- High-Speed (HS): The first commercially available embedded memory with speeds surpassing 600 MHz, HS is an unmatched choice for high- performance computing and networking applications. While optimized for speed, HS consumes lower power than other HS memories. HS is available as Single Port SRAM, Dual Port SRAM, and Multiport Register File.
- STAR Memory System (512Kb and 4Mb): These memories can be used in an SoC to build economical multi-megabit memories with high yield.
About Tower Semiconductor
Tower Semiconductor Ltd. is a pure-play independent wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.18 microns; it also provides complementary manufacturing services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35 microns and can produce up to 20,000 150mm wafers per month. Fab 2 features 0.18-micron and below process technologies, including foundry-standard technology, and will offer full production capacity of 33,000 200mm wafers per month. The Tower Web site is located at http://www.towersemi.com/ .
About Virage Logic
Virage Logic is a global leader in application-optimized semiconductor IP platforms based on memory, logic and design tools that are silicon proven and production ready. Virage Logic meets market demands for cost reduction, while improving performance and reliability for fabless and integrated device manufacturer (IDM) companies focused on the consumer, communications and networking, hand held and portable, and graphics markets. For more information, please contact Virage Logic at www.viragelogic.com or Telephone: 877-360-6690 (toll free) or 510-360-8000.
Safe Harbor Statement for Virage Logic under the Private Securities
Litigation Reform Act of 1995:
Statements made in this news release other than statements of historical fact are forward-looking statements, including, for example, statements relating to Virage Logic's business outlook, new products and new relationships. Forward-looking statements are subject to a number of known and unknown risks and uncertainties, which might cause actual results to differ materially from those expressed or implied by such statements. These risks and uncertainties include Virage Logic's ability to maintain and develop new relationships with third-party foundries, adoption of technologies by semiconductor companies and increases in the demand for their products, the company's ability to overcome the challenges associated with establishing licensing relationships with semiconductor companies, the company's ability to obtain royalty revenues from customers in addition to license fees, business and economic conditions generally and in the semiconductor industry in particular, competition in the market for embedded memories and other risks including those described in the Company's Annual Report on Form 10-K for the period ended September 30, 2001, filed with the Securities and Exchange Commission (SEC) on December 19, 2001, and in Virage Logic's other periodic reports filed with the SEC, all of which are available from Virage Logic or from the SEC's website (www.sec.gov), and in press releases and other communications. Virage Logic disclaims any intention or duty to update any forward-looking statements made in this news release.
NOTE: All trademarks and copyrights are property of their respective owners and are protected therein.
|
Related News
- Freescale Selects Virage Logic's IPrima Mobile(TM) Ultra-Low-Power Memories and STAR Memory System(TM) for 65nm Chips Targeting Cell Phone Market
- Virage Logic Announces Qualification of Embedded Non-Volatile Memory on Tower Semiconductor's 180-nm CMOS Logic Process
- Tower Semiconductor and Virage Logic Announce License Agreement of NOVeA Family of Embedded Non-Volatile Memories
- CHiL Semiconductor Selects Virage Logic's Flexible AEON(R) Non-Volatile Embedded Memory
- Virage Logic Broadens Its Silicon Aware Intellectual Property (IP) Offering with New Release of the STAR(TM) Memory System
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |