The Linley Group Microprocessor Report Details eSilicon 7nm IP
Report examines applications of 7nm IP platforms for AI and networking
SAN JOSE, Calif. — August 14, 2018 — eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the availability of a comprehensive report from the Linley Group that details the company’s 7nm IP portfolio. The Linley Group is an industry-leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications.
The report examines the application of eSilicon’s recently announced 7nm IP platforms for AI and networking. The methodology to configure custom AI accelerators using the eSilicon neuASICÔ platform is detailed. IP discussed in the report includes 56Gbps SerDes, high-bandwidth memory version 2 (HBM2) PHY, ternary content-addressable memory (TCAM) compilers, as well as networking-optimized I/Os and additional types of memory compilers. eSilicon’s approach to 2.5D integration is also discussed, along with a development timeline for its IP platforms and an assessment of the market.
“We were impressed with the progress eSilicon has made in AI and networking,” said Mike Demler, senior analyst at The Linley Group and a senior editor at Microprocessor Report. “These are highly competitive markets and the company’s 7nm IP platforms should provide real differentiation for its customers.”
The report, entitled “eSilicon 7nm SerDes Hits 56Gbps — NeuASIC Platform Includes AI Accelerators for 2.5D/3D ICs” can be downloaded free of charge from the eSilicon website.
About eSilicon
eSilicon is an independent provider of complex FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets. www.esilicon.com
|
Related News
- Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
- The Linley Group Releases First Report Exclusively Focused on Wireless Modem Silicon
- Linley Group Report estimates embedded processor market will exceed $4 billion in 2015
- Multicore Security Processors Show Continued High Growth According to New Linley Group Report
- The Linley Group Releases Second Edition of Popular FPGA Report
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |