English
The Linley Group Microprocessor Report Details eSilicon 7nm IP
Report examines applications of 7nm IP platforms for AI and networking
SAN JOSE, Calif. — August 14, 2018 — eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the availability of a comprehensive report from the Linley Group that details the company’s 7nm IP portfolio. The Linley Group is an industry-leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications.
The report examines the application of eSilicon’s recently announced 7nm IP platforms for AI and networking. The methodology to configure custom AI accelerators using the eSilicon neuASICÔ platform is detailed. IP discussed in the report includes 56Gbps SerDes, high-bandwidth memory version 2 (HBM2) PHY, ternary content-addressable memory (TCAM) compilers, as well as networking-optimized I/Os and additional types of memory compilers. eSilicon’s approach to 2.5D integration is also discussed, along with a development timeline for its IP platforms and an assessment of the market.
“We were impressed with the progress eSilicon has made in AI and networking,” said Mike Demler, senior analyst at The Linley Group and a senior editor at Microprocessor Report. “These are highly competitive markets and the company’s 7nm IP platforms should provide real differentiation for its customers.”
The report, entitled “eSilicon 7nm SerDes Hits 56Gbps — NeuASIC Platform Includes AI Accelerators for 2.5D/3D ICs” can be downloaded free of charge from the eSilicon website.
About eSilicon
eSilicon is an independent provider of complex FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets. www.esilicon.com
|
||||||
Related News
- Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
- The Linley Group Releases First Report Exclusively Focused on Wireless Modem Silicon
- Linley Group Report estimates embedded processor market will exceed $4 billion in 2015
- Multicore Security Processors Show Continued High Growth According to New Linley Group Report
- The Linley Group Releases Second Edition of Popular FPGA Report
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |