Cadence Partners With Leading Test Equipment Vendors to Provide Early System Verification for 2.5/3g and 802.11 Wireless Applications
Cadence Partners With Leading Test Equipment Vendors to Provide Early System Verification for 2.5/3g and 802.11 Wireless Applications
Palladium Hardware-based Verification Methodology Reduces Design Time and Silicon Respins
San Jose, Calif., December 9, 2002 - Cadence Design Systems, Inc. (NYSE:CDN), the world's leading supplier of electronic design products and services, today announced that the Cadence® Palladium(TM) design verification system now has custom interfaces to leading wireless test equipment from Anritsu Corporation, Rohde & Schwarz, and Elektrobit. These companies supply test equipment used by virtually all wireless integrated circuit (IC) and systems companies. Interfacing to wireless testers, combined with Palladium's hardware/software co-verification capability, provides complete system-level verification for the latest 2.5G and 3G handset and base station development, and local-area network (LAN) 802.11 wireless applications.
These new interfaces enable designers to verify and stress test their emulated design with real-world stimulus generated by wireless testers - a system-level verification task otherwise performed after silicon samples have been produced. These powerful environments help wireless companies bridge the gap between simulation and post-silicon debug and find and fix more bugs earlier in the design process, while also concurrently verifying their software drivers and lower-layer protocol stack at emulation speeds. Overall, these capabilities help reduce design cycle times and the risk of costly silicon respins.
LG Electronics Inc. (LGE) is using Palladium for complete system-level verification of its multimillion-gate, 3G WCDMA base station modem chip. "Using Palladium with various wireless test equipment and software debuggers allows us to do hardware and software testing with real-world channel effects, on our six-million-gate, digital base station chip months before getting silicon samples," said Dr. Chul-Heum Yon, vice president of UMTS System Research Lab, LGE.
"We were able to connect third-party software debuggers to the various processors and run software code 10,000 times faster than simulation. We were also able to save valuable time by quickly finding and fixing bugs in the Palladium environment because of its fast compile time - 12 minutes, from RTL to run-time, on one workstation."
LGE utilizes a Cadence-proprietary hardware-based streamer solution along with a hardware-based channel simulator from Elektrobit to add necessary channel effects, such as multi-path fading and power attenuation. This allows LGE to speed-up and enhance the quality of the verification.
"By combining the Anritsu MD8480 tester with Palladium and a channel simulator, it's the first time that all 3G W-CDMA hand-set digital baseband developers can check various layer 1-3 parametric and call processing functions while also having the wireless channel subjected to real-world atmospheric conditions well before silicon is ready," said Hiromichi Toda, president, Anritsu Corporation. "This capability accelerates the verification process and enables developers to speed time-to-market."
As the leading provider of verification solutions to the wireless industry, Cadence has developed an 802.11 wireless LAN solution based on a tester from Rohde & Schwarz. This test environment allows users to verify their wireless LAN chip running in the Palladium system 10,000 times faster than simulation and test protocol compliance.
"Working with leading test equipment companies allows Cadence to continue to accelerate our customers' design cycle and improve the quality of their products," said Christopher Tice, Cadence senior vice president and general manager, Verification Acceleration. "In an aggressive marketplace like wireless and wireless LAN, where nanometer technologies are driving capacities of one million to tens of millions of gates, Palladium becomes a necessary component for high-performance and early system-level verification."
The core components of the wireless verification environment consist of Palladium, the Elektrobit PROPSim DBB or C2 channel simulator, and one of the following testers: the Anritsu MD8480A; the Rohde & Schwarz WinIQSim/AMIQ; and the Cadence Mobile Station Tester. Customers may purchase these components from the respective companies.
About LG Electronics
Established in 1958 as Korea's pioneer consumer electronics company, LG Electronics is a global major player of electronics and Information & Communications products with over 55,000 employees working in 72 overseas subsidiaries and marketing units around the world as well as its business units in Korea. As the fruits of its concentrated endeavors in the innovation and development of leading-edge technologies, LG Electronics has achieved a position as a global leadership in both its core sectors and new digital products such as Digital TV, Internet appliances and next generation mobile handsets. LG Electronics is focused on promoting Home Network and Mobile Network businesses based on cutting-edge multimedia application technology along with Information and Communication Technology as its core business areas. LG Electronics' Goal is to enable the intelligent networking of digital products that will make consumers' lives easier than ever. Further information is located at www.lge.com.
About Cadence
Cadence is the world's largest supplier of electronic design technologies and services. Leading computer, networking, wireless, and consumer electronics companies use the company's solutions to design electronic systems and semiconductors down to nanometer scale. IEEE, the world's largest technical professional society, honored Cadence with its 2002 Corporate Innovation Recognition award. With approximately 5,600 employees and 2001 revenues of approximately $1.4 billion, Cadence has sales offices, design centers, and research facilities around the world. The company is headquartered in San Jose, Calif., and traded on the New York Stock Exchange under the symbol CDN. More information about the company and its products and services is available at www.cadence.com.
Cadence and the Cadence logo are registered trademarks, and Palladium is a trademark of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
|
Cadence Hot IP
Related News
- TTPCom acquires 802.11 Wireless LAN intellectual property from Cadence Design Foundry
- GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g
- Denali Deploys IP and Verification IP for New SATA Revision 2.5 Specification
- Conexant and Interpeak Launch 802.11 Wireless Solution for Embedded Developers
- SeaSolve Software Inc. Announces IEEE 802.15.4 WPAN And IEEE 802.11 WLAN Compliance Test And Analysis Solution
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |