D&R Headline News (Last 14 Days)

Headlines for Thursday Apr. 24, 2025

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TSMC Unveils Next-Generation A14 Process at North America Technology Symposium

A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

• Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
• Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
• S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
• PQShield launches UltraPQ-Suite for deeply specialized implementations of post-quantum cryptography
• Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
• BrainChip Extends RISC-V Reach with Andes Technology Integration
• Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies
• Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
• M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation

Headlines for Wednesday Apr. 23, 2025

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Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments

• Crypto Quantique publishes independent cetome analysis on streamlining CRA compliance with the QuarkLink security platform
• DVB-S2X Wideband LDPC/ BCH Encoder FEC IP Core Available For Licensing and Integration From Global IP Core
• Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions

Headlines for Tuesday Apr. 22, 2025

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Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions

Nextchip license NeuPro-M NPU to bring powerful and highly efficient AI capabilities to boost performance and capabilities of automotive safety systems

• Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
• Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
• MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium

Headlines for Monday Apr. 21, 2025

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Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium 

Analog Bits will be demonstrating its newest LDO, power supply droop detectors, embedded clock LC PLL’s on the TSMC N3P process, and clocking, high-accuracy PVT and droop detectors on the TSMC N2P process at the Analog Bits booth at the TSMC 2025 North America Technology Symposium in Santa Clara, California.

• Alphawave Semi Audited Results for the Year Ended 31 December 2024
• BrainChip Gives the Edge to Search and Rescue Operations
• Shifting Sands in Silicon by Global Supply Chains
• Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
• New Breakthroughs in China's RISC-V Chip Industry

Headlines for Thursday Apr. 17, 2025

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VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables

VeriSilicon’s GCNano3DVG IP combines optimized hardware pipelines with a lightweight and configurable software stack to deliver efficient, low-power graphics processing. It features separate rendering pipelines for 3D and 2.5D graphics, accelerating the rendering of complex scenes composed of 3D objects and vector graphics.

• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• BrainChip Gives the Edge to Search and Rescue Operations
• ASML targeted in latest round of US tariffs
• Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
• Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
• Secafy selects Siemens' EDA tools for innovative hardware security development

Headlines for Wednesday Apr. 16, 2025

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Cadence to Acquire Arm Artisan Foundation IP Business

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and embedded security IP from the pending Secure-IC acquisition.

• Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading
• Intel Announces Strategic Investment by Silver Lake in Altera
• AMD Achieves First TSMC N2 Product Silicon Milestone

Headlines for Tuesday Apr. 15, 2025

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Vertex Growth commits €10M in Dolphin Semiconductor

Vertex Growth is a growth-stage venture capital fund anchored by Vertex Holdings, a subsidiary of global investment firm Temasek. The fund is dedicated to investing in high potential companies on the cusp of scaling-up.

• New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
• Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding
• Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024
• eDP/DP 1.4 Tx PHY & Controller IP Cores Now Available to Meet Rising Demand for High-Performance Display Solutions with Next-Gen Visual Connectivity

Headlines for Monday Apr. 14, 2025

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Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor

The ODT-PVT-ULP-001C-3 provides simple and seamless integration, requiring just a single core-voltage supply and a digital interface, removing the need for added supply voltage complexity, while maintaining precision and highly-localized monitoring next to critical digital subsystems.

• EnSilica - Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
• Why Do Hyperscalers Design Their Own CPUs?
• Beware of the Open-Source Licensing Gap
• Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems
• Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs
• Arm Powers Software-Defined Vehicle Revolution

Headlines for Thursday Apr. 10, 2025

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VeriSilicon Unveils a High-Efficiency LCEVC Video Decoder Supporting 8K Ultra HD

Designed for high-performance and energy-efficient video processing, VC9000D_LCEVC is used in conjunction with VeriSilicon’s VC9000D base video decoder to deliver up to 8K Ultra HD decoding, making it ideal for advanced multimedia applications such as smart TVs, set-top boxes (STBs), and mobile devices.

• TSMC March 2025 Revenue Report
• EnSilica Signs MoU with European Satellite Operator
• Ubuntu developer images now available for OrangePi RV2: a low-cost RISC-V SBC
• Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
• ZeroPoint and Rebellions Forge Strategic Alliance to Revolutionize AI Accelerator Performance and Efficiency

Headlines for Wednesday Apr. 09, 2025

• Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO
• Blumind Secures Series A Funding to Accelerate Analog AI Revolution
• Cyient Announces the Launch of Semiconductor Subsidiary
• UMC Reports Sales for March 2025