Worldwide Semiconductor Equipment Billings Reach $16.7 Billion in Second Quarter 2018, SEMI Reports
MILPITAS, Calif. – September 10, 2018 – Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago, SEMI, the global industry association representing the electronics manufacturing supply chain, reported today.
The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 95 global equipment companies that provide monthly data. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:
2Q2018 | 1Q2018 | 2Q2017 | 2Q18/1Q18 | 2Q18/2Q17 | |
Korea | 4.86 | 6.26 | 4.79 | -22% | 2% |
China | 3.79 | 2.64 | 2.51 | 44% | 51% |
Japan | 2.28 | 2.13 | 1.55 | 7% | 47% |
Taiwan | 2.19 | 2.27 | 2.76 | -4% | -21% |
North America | 1.47 | 1.14 | 1.23 | 29% | 20% |
Europe | 1.18 | 1.28 | 0.66 | -7% | 80% |
Rest of World | 0.96 | 1.27 | 0.62 | -24% | 56% |
Total | 16.74 | 16.99 | 14.11 | -1% | 19% |
Source: SEMI (www.semi.org) and SEAJ, September 2018
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
|
Related News
- Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports
- SEMI Reports Second Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $14.1 Billion
- SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures; Billings US$9.4 Billion
- SEMI Reports Second Quarter 2012 Worldwide Semiconductor Equipment Figures; Billings US$ 10.3 Billion
- Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% Year-Over-Year to Record High of $24 Billion, SEMI Reports
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |