Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms
SOMERVILLE, N.J., Sept. 25, 2018 -- Spectral Design & Test Inc. (SDT) today announced rolling out a family of Memory IP on the GlobalFoundries 14nm FinFET process that addresses the needs of the new Artificial Intelligence (AI), Machine Learning and Deep Learning SoC applications. “Deep learning algorithms require many, sometimes thousands of small processors that all require access to the same data . AI memory architectures require high bandwidth data availability to various processing engines that are in proximity to each other. Furthermore, traditional caching replacement algorithms are not effective for these applications”, said William Palumbo COO of SDT. Our first generation NeuralRAM in the GF 14 nm LP process is a family of configurable memory macros that enable concurrent access of singular or sectors of data at extremely high speeds (>2Ghz) with minimal impact on dynamic power. NeuralRAM has the innate ability to interpret the sequence of Read/Write patterns and make appropriate adjustments to achieve extremely low dynamic power. With appropriate levels of read & write assist, Spectral designs can seamlessly support dynamic voltage scaling without stressing devices. Spectral Design will be exhibiting at the Global Foundries Technology Conference in Santa Clara on September 25th, 2018 and will be available to discuss their MemoryIP with the attendees of the Conference.”
For more information about Spectral’s Silicon Proven Memory IP, please reach out to us at sales@spectral-dt.com
Or check out our website at: www.spectral-dt.com
|
Spectral Design & Test Inc. (SDT) Hot IP
Related News
- GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications
- Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications
- Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |