Gear Radio Introduces Complete Bluetooth 5 Low-Power IP Solution for IoT SoC Applications
Hsinchu, Taiwan -- Nov 21, 2018 - Gear Radio Electronics Corp., Asia’s leading RF IP design company, has announced the launch of its complete Bluetooth 5 low-power IP, which includes the link layer and the use of UMC’s 55nm ultra-low power embedded flash memory technology PHY. Gear Radio’s Bluetooth solution complies with the latest Bluetooth 5 specification, including Long Range. The link layer features advanced data encryption and random number generators for authenticated secure wireless connections, with a PHY output power rating of up to 6 - 10 dBm to achieve a wider coverage area. The RF IP area is 0.6 mm2 and its low power design includes world-class anti-interference indicators to serve IoT System-on-Chip (SoC) applications, providing customers with smaller area and lower power consumption to help chip designers integrate wireless connectivity systems for applications such as wearables and smart homes.
T.H. Lin, director of IP Development and Design Support Division at UMC, said, “To add high-efficiency wireless connectivity to customers’ IoT products, we need reliable, compact and low-power Bluetooth IP solutions. We are pleased to cooperate with Gear Radio on this newly released Bluetooth 5 low-power IP solution to provide customers with better performance, lower power consumption, and easy integration into customer SoC designs. In addition, UMC provides a clear migration path for future product evolution, from our 55nm platform to ultra-low power consumption technologies on 40nm, 28nm and 22nm.”
Ad |
Ceva-Waves Bluetooth 5 dual mode Baseband Controller Ultra low-power 2.4 GHz transceiver for Bluetooth Low Energy 5 |
Guo Bingjie, general manager of Gear Radio Electronics Corporation, said: “Our Bluetooth 5 low-power IP is a complete solution that provides customers with one-stop quality service. Using our solutions can more effectively shorten the development time of customers’ products. We are happy to partner with UMC to support customers around the world and develop low-power RF IP under this excellent process platform. In the future, we will continue to evolve and develop our IP according to market demand and latest specifications. “
About Gear Radio
Gear Radio Electronics Corp. is a wireless RF IC design and service company. It has integrated circuit design experience and a passionate RF technology development partner team that can design a complete RF solution. The entire team has extensive design experience and has design capabilities for all frequency bands in RF applications. We can provide design services for any RF application from 1GHz to commercial 2.4GH to UHF. In addition, we have extensive production experience from 110nm to 28nm process nodes. We have been studying technology in depth and have issued a number of patents. While meeting customer needs, we are constantly pursuing excellence in technology and breakthroughs.
|
Related News
- CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
- Sunrise Micro Devices Announces Low-Power Bluetooth Smart Radio Core to Get Billions of IoT Sensors Talking
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- UMC and Gear Radio Introduce 55nm Bluetooth 5 IP Platform
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |