AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications
November 27, 2018 -- Southampton, UK -- AccelerComm has today announced they have opened their first regional office, selecting Shanghai, China due to the growing demand for high performance communication IP in the region.
China is driving the research and development of advanced communication systems as they strive to be the dominant economy in the telecommunications industry. Both high-performance hardware and software IP from AccelerComm like Polar and LDPC channel coding for 5G NR are required to meet the next generation of cellular standards.
According to a GSMA report on Mobile Economy in 2018, China offers the largest revenue growth opportunity for operators. Especially beyond 2020, China will account for around 40% of global mobile revenue growth between 2017 and 2025.
About AccelerComm
AccelerComm provides LDPC, polar and turbo solutions which enable optimal performance
of communication systems, and solves the challenges that would otherwise limit the speed
of next generation communications, namely the error correction decoding that is required to
overcome the effects of noise, interference and poor signal strength.
For further information visit: www.accelercomm.com.
|
AccelerComm Limited Hot IP
Related News
- PUFsecurity Opens North American Office to Tap Chip Security Market
- Silvaco Opens Shenzhen Office to Support Company's Asian Expansion and Growing Demand for Semiconductor Design Solutions
- Cadence Opens Expanded Shanghai Sales Office and R&D Center
- Chips&Media Opens New Sales and Support Office in Shanghai, China
- Silicon Image Opens New Research & Development Center And Sales Office In Shanghai, China
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |