NSITEXE Develops Test Chip with Next-generation Semiconductor IP Core Called a DFP

December 13th, 2018 -- NSITEXE Inc. will join the 11th AUTOMOTIVE WORLD to be held at Tokyo Big Sight from Wednesday, January 16 to Friday, January 18, 2019. At the event, NSITEXE will unveil a test chip with a next-generation IP core (Data Flow Processor: DFP) that it is developing, as well as a test circuit board to be presented to potential customers and development partners.

Since being established in September 2017, NSITEXE has been building partnerships with companies including ThinCI Inc., a North American startup with key technology for high-performance semiconductors, to accelerate the development of the DFP.

With an improved R&D system and in closer collaboration with partners including Dai Nippon Printing Co., Ltd.,*1 NSITEXE has developed a system on a chip (SoC) to demonstrate the performance of the DFP and a test circuit board on which to mount this SoC, and started trial production. Moreover, NSITEXE plans to start demonstration tests on the DFP, using the test chip and circuit board in the spring of 2019.

In addition to a DFP, the new SoC has two CPUs: Arm®*2 Cortex®-R52 and Wave Computing MIPS*3 I6500 and multiple interfaces, including LPDDR4 and PCIe. The performance of the DFP when used in a vehicle and when used with different embedded system applications will be demonstrated. A software development kit, drivers, a library, and other tools will be prepared and offered to development partners. Demonstration tests are intended to improve the performance of next-generation DFPs and show to customers in different business fields how the DFP accelerates applications.

NSITEXE will continue to offer better semiconductor technology that brings more benefits to society.

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