English
Foxconn Reportedly Readies Chip Fab in China
By Dylan McGrath, EETimes
December 27, 2018
SAN FRANCISCO — Taiwan's Hon Hai Precision is set to break ground in 2020 on a $9 billion 300mm chip fab in the city of Zhuhai in southern China, according to a report by the Nikkei news service.
Hon Hai, which operates under the trade name Foxconn, has been mulling plans since early this year to build and operate its own semiconductor fab to make chips for the products it builds for other firms on a contract manufacturing basis. In August, the Wall Street Journal reported that Foxconn inked a deal with Zhuhai's government to locate its first chip fab there.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- Exec tried to set up copy-cat Samsung fab in China
- China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020
- TSMC Speeds Opening of China Fab
- Samsung to Invest $7 Billion in China Fab
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards