GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration
Santa Clara, Calif. and Grenoble, France, February 19, 2019 – GLOBALFOUNDRIES (GF) and Dolphin Integration, a leading provider of semiconductor IP, today announced a collaboration to develop a series of adaptive body bias (ABB) solutions to improve the energy efficiency and reliability of system-on-chip (SoC) on GF’s 22nm FD-SOI (22FDX®) process technology for a wide range of high-growth applications such as 5G, IoT and automotive.
As part of the collaboration, Dolphin Integration and GF are working together to develop a series of off-the-shelf ABB solutions for accelerating and easing body bias implementation on SoC designs. ABB is a unique 22FDX feature that enables designers to leverage forward and reverse body bias techniques to dynamically compensate for process, supply voltage, temperature (PVT) variations and aging effects to achieve additional performance, power, area and cost improvements beyond those from scaling alone.
The ABB solutions in development consist of self-contained IPs embedding the body bias voltage regulation, PVT and aging monitors and control loop as well as complete design methodologies to fully leverage the benefits of corner tightening. GF’s 22FDX technology offers the industry’s lowest static and dynamic power consumption. With automated transistor body biasing adjustment, Dolphin Integration can achieve up to 7x energy efficiency with power supply as low as 0.4V on 22FDX designs.
“We have been working with GF for more than two years on advanced and configurable power management IPs for low power and energy efficient applications,” said Philippe Berger, CEO at Dolphin Integration. “Through our ongoing collaboration with GF, we are focused on creating turnkey IP solutions that allow designers to realize the full benefit of FD-SOI for any SoC design in 22FDX.”
“In order to simplify our client designs and shorten their time-to-market, GF and our ecosystem partners are helping to pave the way to future performance standards in 5G, IoT and automotive,” said Mark Ireland, vice president of ecosystem partnerships at GF. “With the support of silicon IP providers like Dolphin Integration, new power, performance and reliability design infrastructures will be available to customers to fully leverage the benefits of GF’s 22FDX technology.”
Design kits with turnkey adaptive body bias solutions on GF’s 22FDX will be available starting in Q2 2019.
About Dolphin Integration
Founded in 1985, Dolphin Integration currently employs 160 employees in their head office located in Meylan, France and operates subsidiaries in Canada and Israel. Dolphin Integration develops semiconductor IPs mainly serving high volume fabless IC companies and offers integrated circuit design services to customers worldwide. Conscious of AI, IoT, mobile and automotive products’ explosive growth and potential environmental impact, Dolphin Integration is committed to accelerating the development of energy-efficient System-on-Chip (SoC) for its customers.
Dolphin Integration is the registered tradename of Dolphin Design SAS.
To learn more about the company, please visit: www.dolphin-integration.com
|
Dolphin Design Hot IP
Related News
- GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
- Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
- Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |