Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon
Gothenburg, Sweden -- March 6, 2019 – Cobham Gaisler’s HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon. SpaceIL, an Israeli non-profit organization, assisted by Israel Aerospace Industries (IAI), has constructed the Beresheet lunar lander and launched it atop a SpaceX Falcon 9 rocket from Cape Canaveral Air Force Station on February 21, 2019. Beresheet will take an energy-saving complex route and is expected to arrive in lunar orbit in early April and attempt a landing on April 11.
The GR712RC, a dual-core LEON3FT processor, is employed in the Beresheet mission computer and will manage all aspects of the journey and landing. The processor is based on Cobham Gaisler’s long heritage of LEON SPARC space-ready processor cores and on Ramon Chips’ unique radiation-tolerant silicon technology.
“Ramon Chips developed its RadSafe™ high-reliability silicon technology and applied it in the design of the GR712RC radiation tolerant processor, with demanding missions like Beresheet in mind,” said Prof Ran Ginosar, CEO, Ramon Chips. “SpaceIL’s young entrepreneurs were early adopters of the GR712RC processor and wrote software for it even before the silicon existed. We are confident that this achievement will lead to many more successful space enterprises benefiting from GR712RC.”
“Cobham congratulates the SpaceIL and IAI teams for the successful launch of the Beresheet lunar lander and wish them a successful landing on the Moon”, said Sandi Habinc, General Manager, Cobham Gaisler. "The GR712RC enables a high level of system integration by providing a multitude of interfaces. This, combined with the high computational power of two processor cores, makes it an attractive system-on-chip device with low power consumption that is easy to integrate in spacecraft platform and payload. Close collaboration with Ramon Chips during the GR712RC development resulted in an excellent product, now accepted world-wide as the solution of choice for many space missions.”
“The GR712RC processor forms the heart of the Beresheet onboard computer, providing the required processing power and interfaces to the other spacecraft subsystems, reducing the weight and power consumption that are both critical to this type of mission, while also providing the necessary reliability. All in one chip,” said Opher Doron, VP, General Manager Space Division, Israel Aerospace Industries. “These characteristics greatly simplified the design of the onboard computer and also of the surrounding subsystems on the lander.”
“When we started writing our application software, the GR712RC did not even exists. But the beauty of Cobham Gaisler owning and fully understanding their processor technology, is that they can offer very accurate prototypes and simulators to early adopters, allowing them to be productive with their software development right from the start,” said Dr. Ido Anteby, CEO, SpaceIL NGO. “This allowed us to get a head start with developing what is the most important aspect of any computer application, the actual software, without needing to worry that the final flight hardware would differ and invalidate our development efforts.”
The GR712RC dual-core LEON3FT radiation tolerant processor is sold and supported globally by Cobham. For more information about Cobham’s processor and software products, please visit www.cobham.com/Gaisler
About Ramon Chips, Ltd.
Ramon Chips, Ltd. is an Israeli developer and supplier of software-defined payloads for Space. In addition to supplying the RadSafe™ high-reliability silicon technology, Ramon Chips offers RC64—a radiation-tolerant high-performance manycore DSP chip, NOGAH space payloads enabling highly reliable and high performance space computing at low power, and software systems and applications for spacecraft and satellites. Ramon Chips products address both the high-end high mass satellite market and the low-cost, agile small satellite emerging market. For more information, visit www.ramon-chips.com
About Cobham Advanced Electronic Solutions (CAES)
CAES provides critical solutions for communication on land, at sea, and in the air and space, by moving data through off-the-shelf and customized products and subsystems including RF, microwave, and high reliability microelectronics, antenna apertures and motion control solutions.
Cobham Advanced Electronic Solutions supplies defence, aerospace, security, medical, and industrial markets. Cobham Gaisler is a Business Area of CAES.
About Cobham
Cobham offers an innovative range of technologies and services to solve challenging problems in commercial, defence and security markets, from deep space to the depths of the ocean.
We employ around 10,000 people primarily in the USA, UK, Europe and Australia, and have customers and partners in over 100 countries, with market leading positions in: wireless, audio, video and data communications, including satellite communications; defence electronics; air-to-air refuelling; aviation services; life support and mission equipment.
|
Frontgrade Gaisler Hot IP
Related News
- Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec's Riviera-PRO for HDL Simulation
- Frontgrade Products Enable ESA's JUICE Mission
- Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT
- eASIC Announces Immediate Availability of Aeroflex Gaisler's Leon4 Processor
- Xilinx Announces Microblaze Development Kit 2.1: New Features Enhance Industry's Fastest Soft Processor
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |