North American Semiconductor Equipment Industry Posts March 2019 Billings

MILPITAS, Calif. — April 23, 2019 — North America-based manufacturers of semiconductor equipment posted $1.83 billion in billings worldwide in March 2019 (three-month average basis), according to the March Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.9 percent lower than the final February 2019 level of $1.87 billion, and is 24.6 percent lower than the March 2018 billings level of $2.43 billion.

“March billings of North American test and assembly equipment manufacturers showed modest improvement over the prior month,” said Terry Tsao, chief marketing officer of SEMI. “Despite the increase for this segment, overall billings growth expectations for North American semiconductor equipment suppliers appear to be muted for the rest of the year.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), April 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more

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