Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology
Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP).
May 1, 2019 -- As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge infrastructure, powered by Arm Neoverse solutions. The Neoverse N1 SDP is the industry’s first 7nm infrastructure-specific system development platform, enabling asymmetrical compute acceleration through the CCIX interconnect architecture. The collaboration between Moortec and Arm achieved a solution capable of dynamically sensing in-chip conditions to help optimize power consumption, maximize system speed, and enhance device reliability. The Neoverse N1 SDP is available to hardware and software developers for hardware prototyping, software development, system validation, and performance profiling/tuning.
“Arm Neoverse solutions are designed to deliver the performance and efficiency required to enable the cloud-to-edge infrastructure for a world with a trillion connected devices,” said Mohamed Awad, vice president of marketing, Infrastructure Line of Business, Arm. “Our collaboration with Moortec on the N1 SDP test chip demonstrates how another piece of validated IP fits within the Neoverse platform, accelerating development and adoption of Arm-based solutions across the infrastructure.”
“Through our collaboration, we are helping to enhance performance and efficiency of Arm’s next-generation compute technology on 7nm. By contributing our high accuracy embedded sensing fabric to the development of the Neoverse N1 SDP, we’re enabling customers to benefit from higher performance and reliability within machine learning, artificial intelligence and data analytics applications,“ said Moortec CEO, Stephen Crosher.
About Moortec
Established in 2005 Moortec provides compelling embedded sub-system IP solutions for monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization and power management control systems.
Visit http://www.moortec.com.
|
Related News
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem
- Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in 7nm Process Technology
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |