English
Qualcomm Booking $4.5B in Apple Deal
Windfall comes amid continuing smartphone weakness in China
By Rick Merritt, EETimes
May 1, 2019
SAN JOSE, Calif. – Qualcomm will book a whopping $4.5-$4.7 billion in third quarter revenues as part of the litigation settlement it struck with Apple in mid-April. The funds include both past due patent royalties Apple will pay and Qualcomm’s release from obligations to the iPhone designer and its contract manufacturers.
The windfall will more than double third quarter revenues for the mobile chip giant amid a smartphone market where it sees continued weakness.
Qualcomm executives did not say how it will use the funds. In a quarterly conference call, they pointed to an on-going share buy-back program and a roughly $300 million increase in employee bonuses.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Apple's $1 Billion Baseband Deal
- Analysis: In $2.5B Deal, Qualcomm & CSR Mesh
- Nokia set to pay Qualcomm $2.3bn in patent deal
- Apple announces multibillion-dollar deal with Broadcom for components made in the USA
- Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards