Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process
SANTA CLARA, Calif. and SEOUL, Korea—May 8, 2019—Efinix®, an innovator in programmable product platforms and technologies, and Samsung Electronics today announced a partnership to develop Quantum™ eFPGAs on Samsung’s 10nm silicon process.
“It’s a major leap from 40nm Trion™ T20 FPGA to 10nm Quantum eFPGA. We are achieving PDK to GDS with the advantage of the silicon process-agnostic nature of our Quantum architecture and the tremendous support by the Samsung Memory Business Unit,” said Sammy Cheung, co-founder, CEO, and president of Efinix. “Combining Quantum Power-Performance-Area advantage with Samsung’s leading-edge silicon manufacturing technology, the partnership will offer the most advanced FPGA silicon solutions for markets like AI, Data Centers and Communication Infrastructure.”
“We are glad to see Efinix has made great progress since our initial investment in the company in 2017,” said representative of Samsung Ventures. “We envision Efinix’s FPGA technology embedded inside many other Samsung solutions in the future.”
“Efinix has created the most competitive FPGA technology in the Power-Performance-Area by combining Quantum eFPGA and the Samsung 10nm FinFET process,” said Bill Hata, former senior vice president of Worldwide Operations and Engineering at Altera Corporation (now part of Intel). Hata has more than 30 years of semiconductor industry experience and serves on Efinix’s Advisory Board. “Developing FPGA products on a FinFET process is extremely difficult and challenging. Efinix has accomplished this feat in a short time demonstrating superior engineering and program management.”
Design Automation Conference
Additionally, Efinix will showcase its disruptive FPGA platform at next month’s Design Automation Conference held in Las Vegas June 2nd-6th. To meet with Efinix and learn more about the partnership for Quantum eFPGA on Samsung 10nm, visit: https://www.efinixinc.com/dac2019.
About Efinix
Efinix, an innovator in programmable products, drives the future of edge AI computing with its Trion™ FPGA silicon platform. At the Trion FPGA’s core is Efinix’s disruptive Quantum™ FPGA technology which delivers a 4X Power-Performance-Area advantage over traditional FPGA technologies. Trion FPGAs, offering 4K to 200K logic elements, have a small form-factor, low-power, and are priced for high-volume production. Our Efinity® Integrated Development Environment provides a complete FPGA design suite from RTL to bitstream. With their Power-Performance-Area advantage, Trion FPGAs address applications such as custom logic, compute acceleration, machine learning and deep learning. Through Efinity, our customers can seamlessly migrate FPGA or full system into Quantum ASIC for ultra-high-volume production.
|
Related News
- Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
- QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
- Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
- Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |