First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year
MILPITAS, Calif. — June 3, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today reported that worldwide semiconductor manufacturing equipment billings for the first quarter of 2019 dropped 8 percent from the previous quarter and 19 percent from the same quarter in 2018 to US$13.8 billion.
The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 80 global equipment companies that provide data on a monthly basis. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:
1Q2019 | 4Q2018 | 1Q2018 | 1Q19/4Q18 | 1Q19/1Q18 | |
Taiwan | 3.81 | 2.81 | 2.27 | 36% | 68% |
Korea | 2.89 | 3.13 | 6.26 | -8% | -54% |
China | 2.36 | 2.69 | 2.64 | -13% | -11% |
North America | 1.67 | 1.94 | 1.14 | -14% | 47% |
Japan | 1.55 | 2.65 | 2.13 | -41% | -27% |
Europe | 0.84 | 0.91 | 1.28 | -8% | -34% |
Rest of World | 0.67 | 0.82 | 1.27 | -18% | -47% |
Total | 13.79 | 14.96 | 16.99 | -8% | -19% |
Source: SEMI (www.semi.org) and SEAJ, June 2019
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.
|
Related News
- First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year
- Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent, SEMI Reports
- Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter
- Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports
- Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |