Efabless Collaborates with GLOBALFOUNDRIES to Enable New IP Development Models for Emerging Applications
Collaboration Expands Efabless Design Platform and GLOBALFOUNDRIES IP Ecosystem
SAN JOSE, Calif., June 04, 2019 -- Efabless, a crowdsourcing design platform for custom silicon, today announced a joint relationship with GLOBALFOUNDRIES (GF) that will extend Efabless’ design platform, Chiplicity, to include select technology nodes from GF. As part of the collaboration, GF’s 130G, the company’s 130nm process technology platform, will be offered on Efabless' Chiplicity, which includes an IP Development Program that provides IP designers access to EDA tools, infrastructure and prototyping services to accelerate the development of a wide range of IP. Efabless will provide access to GF’s proven 130G technology offering to Efabless’ design partners and community by August 2019.
Through Chiplicity, Efabless provides multiple services enabling its design partners and community members to deliver novel solutions for emerging applications. The Design Platform provides a complete EDA design flow based on qualified open-source tools, access to foundry process technologies, IP and SoC reference designs, as well as prototyping and production fabrication services. Through the capabilities and processes available on the platform, Efabless provides an efficient path for partners to develop custom ICs and silicon-proven IP with limited costs and resources. IP created by partners as well as a larger global community of design professionals can will be made available through the Efabless Design Marketplace and leveraged into ASIC or standard IC designs by customers or ASIC design partners. Design partners can also receive requests for custom IP or services from end-customers or other ASIC design partners through a Design Request process.
The addition of GF on Efabless’ Chiplicity powers a new development model for the creation of innovative IP through an expanded network of design firms and professionals. The combination offers a unique alternative for meeting custom requirements for a broader market of emerging applications.
“We are very pleased to work with GF on this important and exciting initiative,” said Mike Wishart, CEO of Efabless. “GF brings the power of its world-wide customer presence and leading technology to our growing network of design firms and professionals. We look forward to working with GF to deliver world class IP that is necessary for today’s exciting new customer applications."
"We are pleased to team with Efabless’ IP development program,” said Mark Ireland, vice president of ecosystem partnerships at GF. “GF’s proven 130G offering enables Efabless to provide designers with a single-chip, programmable, power solution for analog/power SOCs. We believe our collaboration with Efabless will simplify the enablement process and increase the breadth of IP and services available to our clients.”
About Efabless
Efabless.com is the world’s first crowdsourcing platform for semiconductors. Efabless’ customers connect with a community of design firms and professionals and receive formal quotes for custom mixed signal IC and IP solutions. Efabless then provides its IC design community with a cloud-based platform offering everything needed to execute the designs. This includes a design flow based on open source tools; a marketplace featuring IP and full reference designs; access to foundry processes and MPW services to get to prototypes. The entire offering is designed to eliminate the cost and administrative barriers that have inhibited IC design in general and custom IC design in particular.
Efabless is headquartered in San Jose, CA
For more information, visit www.efabless.com
|
Related News
- Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications
- GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development
- Flex Logix Announces nnMAX AI Inference IP In Development On GLOBALFOUNDRIES 12LP Platform
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |