intoPIX Presents the Smart Path for AV Over IP at InfoComm 2019
Demonstration proves why the industry prefers 4K60 444 over CAT5e and 1GbE
MONT-SAINT-GUIBERT, Belgium -- June 11, 2019 -- intoPIX, the leading provider of innovative image processing and compression, will feature new demo and partner products of the intoPIX JPEG 2000 ULL, TICO-XS, and FLinQ technologies for distributing 4K60 444 HDR under 1GbE at InfoComm 2019 in Orlando, FL.
intoPIX unique Pro-AV JPEG2000 ULL technology has been optimized for Pro-AV and the improved algorithm is specifically suited to screen content such as fine text, excel spreadsheets, CGI content, but also natural imagery. In 4K60 444, the total latency of intoPIX FPGA IP-cores goes down below 10 milliseconds which makes it imperceptible for the human eyes.
intoPIX’s will also demo the innovative lightweight low-power TICO-XS FPGA cores and FastTICO-XS SDKs software implementations able to distribute 4K60 444 over standard CAT5e cables & switchers. Standardized at ISO as JPEG XS, it is built to be implemented within the new SMPTE ST 2110 ecosystems, also represented by AIMS Alliance at infoComm. Meanwhile the TICO-XS stream is able to retain full quality and a microsecond latency. A hardware and side-by-side with uncompressed demonstration will be shown on their booth #2477.
Next to the technology demos, the imaging pioneer is to showcase multiple products of leading Pro-AV manufacturers such as Crestron, Icron, and EvertzAV powered by intoPIX technologies. Part of this showcase is Crestron’s updated DM NVX series, enabled by newest intoPIX FlinQTM technology, a revolutionary processing presented for the first time at ISE. A live product demo can be found on Crestron’s booth #1800 under “Pixel Perfect Processing”.
About intoPIX
intoPIX creates and delivers innovative image processing, video compression, and security technologies to professional AV equipment manufacturers. We are passionate about offering people a higher quality image experience and have developed FPGA/ASIC IP-cores and software tools that form the basis to high quality AV over IP and AV over wireless solutions. We enable the world to manage more pixels over existing networks, while reducing power consumption with a best-in-class image quality and microsecond latency.
More information on www.intopix.com.
|
intoPIX Hot IP
Related News
- intoPIX and Macnica Preview a 4K AV over 1GbE Module Powered by TICO-XS and ST 2110 IP Transport for Pro AV Market at ISE 2019
- Icron Technologies Announces New Maverick Extension Platform Featuring ExtremeUSB 2.0 and 3.0 with intoPIX TICO UHD Video over Single Cable at InfoComm 2016
- intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
- Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |