D&R Headline News (Last 14 Days)

Headlines for Wednesday Feb. 05, 2025

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Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip

Ceva today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip.

• Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
• Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs

Headlines for Tuesday Feb. 04, 2025

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CoMira Solutions unveils its new 1.6T Ethernet UMAC IP

CoMira Solutions today announced its new 1.6T Ethernet UMAC IP. This specified UMAC IP delivers 1.6Tbps bandwidth with low latency and minimized logic size, which is ideal for AI, ML, and hyperscale data centers.

• Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
• intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
• RISC-V in Space Workshop 2025 in Gothenburg
• Dolphin Semiconductor strengthens its governance with two key Board appointments

Headlines for Monday Feb. 03, 2025

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Intel Halts Products, Slows Roadmap in Years-Long Turnaround

Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that will take years, according to analysts surveyed by EE Times.

• UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips

Headlines for Thursday Jan. 30, 2025

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EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

• Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
• intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
• TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
• Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
• Ceva, Inc. Appoints Amir Faintuch to its Board of Directors
• Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
• Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors

Headlines for Wednesday Jan. 29, 2025

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Mixel Announces the Opening of New Branch in Da Nang, Vietnam

This office represents a key milestone for Mixel as its first in Asia. It will enable Mixel to expand its engineering talent, better serve its global customer base and strengthen its presence in the region.

• intoPIX and Nextera-Adeas Announce Latest IPMX Demo Design with JPEG XS on Compact FPGAs at ISE 2025
• Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+

Headlines for Tuesday Jan. 28, 2025

• Plexus and intoPIX Expand IPMX Solutions Offering
• Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Headlines for Monday Jan. 27, 2025

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RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU

The new embedded accelerator boosts inference speed by 2.4x, combining complete privacy and autonomy with a groundbreaking innovation: it eliminates the need for CPUs.

Headlines for Thursday Jan. 23, 2025

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Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety

Andes Technology today announced that its D45-SE processor has successfully achieved ISO 26262 ASIL-D with the certification of SGS TÜV. This certification marks a significant achievement for Andes Technology, confirming that the D45-SE processor meets the highest automotive safety standards required for safety-critical applications in the automotive industry.

• Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
• VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
• ARM boost in $100bn Stargate data centre project

Headlines for Wednesday Jan. 22, 2025

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Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon

The first public specificiation for the Arm Chiplet System Architecture is now available, with over 60 companies contributing to its development.

• MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
• MIPI Alliance Announces Board Leadership Appointments
• Alphawave Semi Q4 2024 Trading and Business Update
• ST-GloFo fab plan shelved

Headlines for Tuesday Jan. 21, 2025

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Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

Leading embedded security offerings will complement Cadence’s expanding IP portfolio, unlocking a growing multi-hundred-million incremental TAM opportunity

• Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
• Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
• YorChip announces patent-pending Universal PHY for Open Chiplets
• PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
• Credo to Exhibit at Chiplet Summit 2025