SmartDV to Exhibit at OpenPower Summit August 19-20
Will Feature First Commercially Available OpenCAPI Verification IP
SAN JOSE, CALIF –– August 13, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Verification Intellectual Property (VIP) supporting simulation emulation, field programmable gate array (FPGA), formal models and post-silicon validation platforms, Design IP and rapid customized VIP and Design IP development will feature the first commercially available OpenCAPI Verification IP compatible with the OpenCAPI 3.0 and 3.1 standard at the OpenPower Summit.
WHEN: Monday and Tuesday, August 19 and 20. Attendees can schedule demonstrations through: demo@smart-dv.com
WHERE: Manchester Grand Hyatt, San Diego, Calif.
SmartDV’s OpenCAPI Verification IP verifies OpenCAPI interfaces and includes an extensive test suite that performs random or directed protocol tests to create a range of scenarios to effectively verify the design under test. It supports all major verification languages and methodologies, including open verification methodology (OVM), universal verification methodology (UVM) and SystemC.
About SmartDV
SmartDV™ Technologies is the Proven and Trusted choice for Verification and Design IP with the best customer service from more than 250 experienced ASIC and SoC design and verification engineers. Its high-quality standard or custom protocol Verification and Design IP are compatible with all verification languages, platforms and methodologies supporting all simulation, emulation and formal verification tools used in a coverage-driven chip design verification flow. The result is Proven and Trusted Verification and Design IP used in hundreds of networking, storage, automotive, bus, MIPI and display chip projects throughout the global electronics industry. SmartDV is headquartered in Bangalore, India, with U.S. headquarters in San Jose, Calif. Visit SmartDV to learn more.
|
SmartDV Technologies Hot IP
SmartDV Technologies Hot Verification IP
Related News
- Andes Technology to Exhibit Groundbreaking RISC-V Solutions for AI and Automotive at RISC-V Summit North America 2023
- OPENEDGES To Exhibit its 4-/8-bit mixed-quantization NPU IP at Embedded Vision Summit 2022
- SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
- Chips&Media to Exhibit at the 2020 Embedded Vision Summit
- SmartDV's TileLink, Verilator VIP on Full Display at RISC-V Summit
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |