Wi-Fi 6 (ax)+BLEv5.4+15.4 Dual Band RF IP for High-End Applications.
Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
By Nitin Dahad, EETimes
September 6, 2019
Berlin, Germany — Mobile processors with integrated 5G modems are the flavor of the week, as Europe’s equivalent of CES kicked off in Berlin with launches from Huawei, Samsung and Qualcomm.
With big fanfare, Huawei launched what it claims is the world’s first flagship 5G system on chip (SoC), the Kirin 990 5G, a 10.3 billion transistor chip manufactured in a TSMC 7nm+ EUV process and supporting both non-standalone (NSA) and standalone (SA) radio architectures simultaneously. The chip will be a key feature of the Huawei Mate 30 phone launching in a couple of weeks.
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