English
Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
By Nitin Dahad, EETimes
September 6, 2019
Berlin, Germany — Mobile processors with integrated 5G modems are the flavor of the week, as Europe’s equivalent of CES kicked off in Berlin with launches from Huawei, Samsung and Qualcomm.
With big fanfare, Huawei launched what it claims is the world’s first flagship 5G system on chip (SoC), the Kirin 990 5G, a 10.3 billion transistor chip manufactured in a TSMC 7nm+ EUV process and supporting both non-standalone (NSA) and standalone (SA) radio architectures simultaneously. The chip will be a key feature of the Huawei Mate 30 phone launching in a couple of weeks.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- SK hynix's memory chips next in Huawei's 5G phone saga
- Qualcomm Taps Samsung's 7nm EUV for 5G
- Qualcomm signs UMC, Samsung for 28-nm chips, says report
- Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards