Fabs Valued at Nearly $50 Billion to Start Construction in 2020
MILPITAS, Calif. – September 12, 2019 – Investments in new fab projects starting construction in 2020 is expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to the latest update of the World Fab Forecast from SEMI. See figure 1.
Fifteen new fab projects with a total investment of US$38 billion will have started construction by the end of 2019 with 18 more fab projects forecast to start construction in 2020. Of the 18, 10 fab projects with a total investment value of more than US$35 billion carry a high probability and the other eight, with a total investment value of more than US$14 billion, are weighted with a low probability of materializing.
Figure 1: Total investments (construction and equipment) for new fabs and lines (greenfield, shell, new line) starting construction through 2020
Facilities that commence construction in 2019 will begin equipping as early as the first half of 2020, with some starting to ramp production as early as mid-2020. These new fab projects will add more than 740,000 wafers per month (in 200mm equivalents). Most of the additional capacity will be dedicated to foundries (37%) followed by memory (24%) and MPU (17%). Of the 15 new fab projects in 2019, about half are for 200mm wafer sizes. See figure 2.
Figure 2: Fab Count by wafer size for new fabs and lines (greenfield, shell, new line) starting construction in 2019 and 2020
The fab projects to begin construction in 2020 are expected to produce more than 1.1 million wafers per month (in 200mm equivalents). Most of these fabs and lines will begin equipping in 2021. The high-probability fabs will increase capacity by 650,000 wafers per month (in 200mm equivalents) while the low-probability facilities may add another 500,000 wafers per month (in 200mm equivalents). The bulk of the capacity will be for foundry (35%) and memory (34%) across various wafer sizes.
Published by the Industry Research and Statistics Group at SEMI, the World Fab Forecast covers new, planned and existing fabs as well as fab spending for construction and equipping, capacity expansion, and technology nodes by quarter and by product type with more than 1,300 front-end fab listings. All told, 192 updates have been made to the report, including the addition of 64 new facilities and lines since its previous publication in June 2019. The World Fab Forecast also includes projections for fabs and lines starting construction beyond 2020.
Learn more about SEMI fab databases.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org
|
Related News
- Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports
- Intel Supports American Innovation with $7 Billion Investment in Next-Generation Semiconductor Factory in Arizona
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
- Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |