Huawei & Arm Meet Behind Closed Doors
By Amy Guan, EETimes
September 27, 2019
SHENZHEN, China — Executives from Arm, Arm China and HiSilicon (Huawei’s chip division) met behind closed doors on Wednesday morning (Sept. 25th) at the Intercontinental Hotel in Shenzhen, and when they emerged they stood for a group photo that said more about the US-China trade war than anything the three companies had actually said in four months. That snapshot served to reassure the Chinese media and the local electronics industry of the continuing cooperation among Arm, Arm China and Huawei.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Confidential Computing Consortium Establishes Formation with Founding Members and Open Governance Structure
- Arm Deals Massive Blow to Huawei
- Arm unveils new image signal processors to meet higher image quality requirements
- Arm Drives Smart Utilities for KEPCO's Behind the Meter Project
- INSIDE Secure Announces the First DRM Solutions on an ARM Reference Platform to Meet HD/UHD Content Protection Demands of Hollywood Studios
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks