North American Semiconductor Equipment Industry Posts September 2019 Billings
MILPITAS, Calif. — October 22, 2019 — North America-based manufacturers of semiconductor equipment posted $1.95 billion in billings worldwide in September 2019 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.4 percent lower than the final August 2019 level of $2.00 billion, and is 6.0 percent lower than the September 2018 billings level of $2.08 billion.
“Monthly billings of North American equipment manufacturers declined for the second consecutive month,” said Ajit Manocha, president and CEO of SEMI. “However, year-over-year billings shows signs of bottoming, and recent capital expenditure increases for leading-edge logic will provide near-term billings growth opportunities."
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Billings | Year-Over-Year | |
April 2019 | $1,922.0 | -28.5% |
May 2019 | $2,065.2 | -23.6% |
June 2019 | $2.026.1 | -18.4% |
July 2019 | $2,031.9 | -14.6% |
August 2019 (final) | $2,001.8 | -10.5% |
September 2019 (prelim) | $1,953.7 | -6.0% |
Source: SEMI (www.semi.org), October 2019
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.
|
Related News
- North American Semiconductor Equipment Industry Posts September 2021 Billings
- North American Semiconductor Equipment Industry Posts September 2020 Billings
- North American Semiconductor Equipment Industry Posts December 2019 Billings
- North American Semiconductor Equipment Industry Posts November 2019 Billings
- North American Semiconductor Equipment Industry Posts October 2019 Billings
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |