Palma Ceia SemiDesign Establishes United Kingdom Center
SANTA CLARA, California, Nov. 1, 2019 -- Palma Ceia SemiDesign, a provider of next-generation wireless connectivity solutions, today announced the opening of a design center in Cambridge, United Kingdom. This addition will expand research & development efforts and support the company's growing worldwide customer base.
The expansion will accelerate IoT chip product development by bringing additional world-class design and production experience to Palma Ceia SemiDesign. The Cambridge team will work with a growing worldwide engineering team building advanced IoT connectivity products. The new design center adds critical resources necessary to achieve the company's mission to bring new and innovative IoT products and services to the market.
"Our decision to open our newest design center in the UK is another step in our continued growth to become a leading wireless IC supplier," said Roy E. Jewell, president and CEO of Palma Ceia SemiDesign. "It will enable us to access a very experienced base of wireless designers in the UK, thus more quickly broadening our connectivity product offering, and provide greater service and support to our growing customer base worldwide."
The Cambridge UK Technology Cluster, also known as Silicon Fen, has been at the forefront of mixed-signal SoC design since its inception. The Cambridge design center draws on the region's depth of experience in mixed-mode SoC design and includes engineers who have been responsible for key innovations in driving forward large-scale integration of CMOS radio designs for cellular, PAN and WAN standards. The team includes world-class RF, analog, digital and DSP engineering expertise with a proven track record of over 2 billion device deliveries.
The addition of the Cambridge team is the latest step in the global expansion Palma Ceia SemiDesign began in 2017. It follows the recent opening of facilities in Hong Kong and China. Contact information is available on the Palma Ceia SemiDesign website.
About Palma Ceia SemiDesign
Palma Ceia SemiDesign is a provider of communication IP and chips for next-generation WiFi and cellular applications. With a focus on emerging WiFi and LTE standards, PCS targets the design of ICs for broadband, wireless, medical and automotive applications. Palma Ceia solutions are differentiated by low-power, high-performance and ease of integration. With operational headquarters in Hong Kong, the company has its North American operations headquartered in Santa Clara, Calif., and original design center in McKinney, Texas. Additional sales and support activities are located in greater China, Israel, Japan, Korea, Taiwan and the United Kingdom. Visit Palma Ceia SemiDesign on the web at www.pcsemi.com.
|
Palma Ceia SemiDesign Hot IP
Related News
- Palma Ceia SemiDesign Establishes China Subsidiary for Development and Support
- Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021"
- Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |