EnSilica and Macnica Europe GmbH Sign Distribution Agreement for Custom ASIC Design and Supply Services
Wokingham, UK – December 2, 2019 – EnSilica, a leading provider of custom ASIC design and supply services has signed a distribution agreement with Macnica Europe, a leading distributor of semiconductor products and design-in services. With this agreement EnSilica will be able to offer custom ASIC based solutions to Macnica’s OEM customers, with Macnica providing global fulfilment and logistics services that meet the demanding requirements of automotive and industrial customers.
Through this agreement Macnica’s customers will be able to access EnSilica’s world-class expertise in developing custom ASIC integration functions such as analogue sensors, RF connectivity and Arm processors as well as cryptographic and AI accelerators.
“Our partnership with Macnica is the result of our shared vision that the cost and technical benefits of a custom ASIC solution are now within the reach of a growing number of OEM and automotive Tier 1 customers.” said Ian Lankshear, CEO at EnSilica. “Macnica have an enviable reputation for their component design-in, fulfilment and ongoing support services and EnSilica are delighted to complement this by offering our custom ASIC solutions to their global network of customers.”
“EnSilica will be a key partner in allowing us to offer highly differentiating ASIC solutions to our customers alongside our standard line card.” said Juergen Poeschl, Managing Director at Macnica Europe. “When standard components don’t fit an application, because the functionality, form factor, power budget or cost point cannot be met, then an ASIC can offer an excellent alternative if the volumes warrant the development cost.”
About EnSilica
EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, and IC design services for companies with their own design teams. The company has world-class expertise in supplying custom analog, mixed signal and digital IC’s to its international customers in the automotive, industrial, healthcare and consumer markets. The company also offers a broad portfolio of core IP covering cryptography, Radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards such as the automotive functional safety standard ISO 26262.
About Macnica Europe GmbH
Macnica’s European headquarter was originally established in the UK in 2006, and moved to Germany in July 2008, to increase efficacy of its service for European customers. By it’s acquisition of the Munich based company Scantec Mikroelektronik in 2014 Macnica Europe formed a powerful semiconductor distribution with headquarters in Munich and Ingolstadt and numerous sales offices in Europe offering an attractive and competitive portfolio of highly sophisticated devices. Macnica provides end to end support from design-in to production through its global service network to its customers, regardless of the final destination of the product shipment to customers’ manufacturing locations.
|
EnSilica Ltd. Hot IP
Related News
- EnSilica plc - Award of £2 million Controller ASIC Design Services Contract
- EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets
- EnSilica builds sales network to extend its design and supply services for the automotive sector
- Two Senior-Level Appointments Boost EnSilica's Rapidly Expanding SoC Design and Supply Services
- INSIDE Secure and Presto Engineering to sign a partnership agreement to outsource INSIDE Secure’s semiconductor operations and supply chain activities to specialist provider, Presto Engineering
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |