EnSilica and Macnica Europe GmbH Sign Distribution Agreement for Custom ASIC Design and Supply Services
Wokingham, UK – December 2, 2019 – EnSilica, a leading provider of custom ASIC design and supply services has signed a distribution agreement with Macnica Europe, a leading distributor of semiconductor products and design-in services. With this agreement EnSilica will be able to offer custom ASIC based solutions to Macnica’s OEM customers, with Macnica providing global fulfilment and logistics services that meet the demanding requirements of automotive and industrial customers.
Through this agreement Macnica’s customers will be able to access EnSilica’s world-class expertise in developing custom ASIC integration functions such as analogue sensors, RF connectivity and Arm processors as well as cryptographic and AI accelerators.
“Our partnership with Macnica is the result of our shared vision that the cost and technical benefits of a custom ASIC solution are now within the reach of a growing number of OEM and automotive Tier 1 customers.” said Ian Lankshear, CEO at EnSilica. “Macnica have an enviable reputation for their component design-in, fulfilment and ongoing support services and EnSilica are delighted to complement this by offering our custom ASIC solutions to their global network of customers.”
“EnSilica will be a key partner in allowing us to offer highly differentiating ASIC solutions to our customers alongside our standard line card.” said Juergen Poeschl, Managing Director at Macnica Europe. “When standard components don’t fit an application, because the functionality, form factor, power budget or cost point cannot be met, then an ASIC can offer an excellent alternative if the volumes warrant the development cost.”
About EnSilica
EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, and IC design services for companies with their own design teams. The company has world-class expertise in supplying custom analog, mixed signal and digital IC’s to its international customers in the automotive, industrial, healthcare and consumer markets. The company also offers a broad portfolio of core IP covering cryptography, Radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards such as the automotive functional safety standard ISO 26262.
About Macnica Europe GmbH
Macnica’s European headquarter was originally established in the UK in 2006, and moved to Germany in July 2008, to increase efficacy of its service for European customers. By it’s acquisition of the Munich based company Scantec Mikroelektronik in 2014 Macnica Europe formed a powerful semiconductor distribution with headquarters in Munich and Ingolstadt and numerous sales offices in Europe offering an attractive and competitive portfolio of highly sophisticated devices. Macnica provides end to end support from design-in to production through its global service network to its customers, regardless of the final destination of the product shipment to customers’ manufacturing locations.
|
EnSilica Ltd. Hot IP
Related News
- EnSilica plc - Award of £2 million Controller ASIC Design Services Contract
- EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets
- EnSilica builds sales network to extend its design and supply services for the automotive sector
- Two Senior-Level Appointments Boost EnSilica's Rapidly Expanding SoC Design and Supply Services
- INSIDE Secure and Presto Engineering to sign a partnership agreement to outsource INSIDE Secure’s semiconductor operations and supply chain activities to specialist provider, Presto Engineering
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |