PRO DESIGN Extends FPGA Based Prototyping Portfolio With proFPGA XCVU13P Module - Offering Highest Interface and System Performance
MUNICH -- Dec. 19, 2019 -- PRO DESIGN, leading supplier of FPGA based verification systems, today announced the release of its new XCVU13P FPGA module for its successful and innovative proFPGA product family of FPGA based prototyping solutions.
The proFPGA product series include the fastest and most flexible scalable FPGA systems on the market. proFPGA is based on latest Xilinx Virtex® UltraScale+™ and Intel® Stratix® 10 FPGA technologies. It addresses customers who need an extremely efficient and best-performing FPGA-based prototyping solution for ASIC, IP and SoC prototyping, real-time system integration and pre-silicon software development that allows them to be the first on the market.
The new proFPGA XCVU13P FPGA Module is designed and optimized for best signal integrity and maximum performance. High-speed PCB design and materials in combination with the latest Samtec® SEARAY® and recently released NOVARAY® high-speed connectors, allows the proFPGA XCVU13P FPGA Module to reach an outstanding point-to-point speed of more than 1.4 Gbps single-ended over the regular FPGA IOs and a trailblazing performance of up to 32.75 Gbps over the GTY transceivers. That means that customers can use the maximum speed that the FPGA device offers on the proFPGA XCVU13P FPGA Module!
The new FPGA module, which is assembled with the latest Xilinx Virtex® UltraScale+™ XCVU13P FPGA, offers on 9 extension sites 714 free accessible user IOs and an ASIC equivalent capacity up to 20 million gates.
The highlight and distinguishing feature of this FPGA module is the availability and performance of the 52 multi-gigabit transceivers on 6 extension sites which allow to run stable with a superb performance of up to of 32.75 Gbps. With this performance the new proFPGA member is the best-in-class platform for verifying designs with high speed interfaces like PCIe Gen5, QSFP28 (a corresponding daughter board already available!) for market leading and innovate applications like 5G, Machine Learning (ML), Data Center or High-Performance Computing.
"Designing a modular FPGA system reaching an interface performance of 32.75 Gbps was a big challenge and I wasn't sure, whether this was doable, because you are reaching the physical limits. Therefore, I'm really happy, proud and excited that our outstanding R&D and manufacturing team was able to achieve that and that we can release this new FPGA module from which many of our customers will benefit from. They have now a vehicle to verify even latest high-speed designs with real world interfaces in full speed," said Gunnar Scholl, CEO from PRO DESIGN.
The new proFPGA XCVU13P FPGA Module can be easily assembled on the proFPGA uno, duo or quad motherboards and can be mixed with existing proFPGA FPGA modules. It is fully compatible with all proFPGA accessories like interface boards and interconnection cables. The new proFPGA XCVU13P FPGA Module will be available in January 2020.
About PRO DESIGN
The privately-held company was founded in 1982 and has 100 employees, with various facilities in Germany, France, and the US. PRO DESIGN has more than 37 years of experience in the EDA market, and as a provider in the E²MS market. PRO DESIGN has built extensive knowledge in the areas of FPGA board development, electronic engineering, FPGA design, high performance PCB design, construction, production, assembly and testing.
For more information, please visit: http://www.proFPGA.com
|
Related News
- PRO DESIGN Completes FPGA based Prototyping Portfolio with proFPGA Uno V7 System
- PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs
- PRO DESIGN Expands FPGA Prototyping Portfolio with High-Speed proFPGA Virtex UltraScale based FPGA Modules
- PRO DESIGN Releases Embedded Processing Platform for FPGA based SoC and IP Prototyping
- Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |