Sharp licenses wireless IP from InterDigital
Sharp licenses wireless IP from InterDigital
By Semiconductor Business News
September 4, 2001 (7:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010904S0084
KING OF PRUSSIA, Penn. -- InterDigital Communications Corp. here today announced that it has entered into a royalty-bearing patent license agreement with Japan's Sharp Corp. Under the terms, InterDigital will license its chip-level intellectual-property to Sharp. The agreement covers wireless handsets, modules and communications cards based on second- and third-generation wireless technologies. It also includes the CDMA, GSM, HDR, and GPRS standards.
Related News
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- HunterSun Corporation Licenses AndesCore N1068A-S for Its HS6601 Single-Chip Bluetooth SoC Targeting Wireless Audio Applications
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |