Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand
SAN JOSE, Calif. -- Feb 13, 2020 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that it has acquired Integrand Software, Inc. to further accelerate innovation in the 5G RF communications space. Integrand’s EMX® technology has the industry-leading Method of Moments (MoM) solver technology for analysis and extraction and enables designers to accurately and efficiently simulate large integrated circuits (ICs) and advanced packages, characterize passive components and analyze interconnect parasitics in 3D-IC systems.
Executing upon the Cadence® Intelligent System Design™ strategy, the integration of Integrand EMX with the Cadence Virtuoso®, Sigrity™, Clarity™ and AWR® solutions offers customers a complete electromagnetic signoff solution.
The terms of the transaction were not disclosed.
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to Intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications
- Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation
- Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation
- Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |