GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
Santa Clara, California, and Hsinchu, Taiwan -- February 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and GlobalWafers Co., Ltd. (GWC), one of the top three silicon wafer manufacturers in the world, today announced they have signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300mm silicon-on-insulator (SOI) wafers.
GWC is one of the world’s leading manufacturers of 200mm SOI wafers, and has a long and ongoing relationship with GF for supplying 200mm SOI wafers. GWC also manufactures 300mm SOI wafers, and under the anticipated supply agreement, GWC and GF will collaborate closely to significantly expand GWC’s 300mm SOI wafer manufacturing capacity.
GF intends to use the resulting additional supply of 300mm SOI wafers to meet the growing demand for its industry-leading RF SOI technologies, which are optimized to deliver a low power, high performance, and easy-to-integrate solution for current and next-generation mobile and 5G applications.
“Mobile, wireless, and 5G represent a significant opportunity for GLOBALFOUNDRIES, and our vital RF technology is featured in more than 85 percent of smartphones on the market today,” said Bami Bastani, senior vice president for mobile and wireless infrastructure at GF. “We are pleased to collaborate with GlobalWafers, and look forward to working with them to develop and qualify an additional supply of 300mm SOI wafers to integrate into our manufacturing processes and help meet the growing demand for our RF SOI solutions.”
“Given our market position, it is in our best interest – and the best interest of our clients – to build out and diversify the supply chain for 300mm SOI wafers,” said Tom Weber, senior vice president and chief procurement officer at GF. “GlobalWafers is the right partner for us to make this happen.”
“We are pleased with this opportunity to extend the long-standing partnership between GlobalFoundries and GWC, in light of the market evolution toward next-generation RF applications,” said Doris Hsu, Chairman and CEO of GWC. “Ultimately, this collaboration will lead to even greater success for both companies.”
About GlobalWafers Co., Ltd.
GlobalWafers, headquartered in Hsinchu, Taiwan, is one of the three largest silicon wafer manufacturers in the world. Founded in 1981, it was the semiconductor business unit of SAS (Sino-American Silicon Products Inc.) and spun off as GlobalWafers Co., Ltd. in 2011. Specializing in silicon wafer manufacturing, its product applications extend through power management, automotive, IoT, memory, sensors and MEMS. GlobalWafers operates out of 15 facilities in Taiwan, Japan, USA, Korea, Italy, Denmark, Malaysia, and China and is listed on the
Taipei Stock Exchange. For more information about GlobalWafers, please visit http://www.sas-globalwafers.com.
About GLOBALFOUNDRIES
GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.
|
Related News
- GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government
- Everspin and GLOBALFOUNDRIES partner to supply fully processed 300mm CMOS wafers with Everspin's ST-MRAM technology
- GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply
- GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center
- GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications
Breaking News
- EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
Most Popular
- Arm's power play will backfire
- Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering
- Sondrel announces CEO transition to lead next phase of growth
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
E-mail This Article | Printer-Friendly Page |