Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds
MILPITAS, Calif. — May 4, 2020 — Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of 2,844 million square inches, but dropped 4.3 percent year-over-year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
"Global silicon wafer shipments rebounded slightly in the first quarter of 2020 after declining for one year,” said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. “However, with the disruptions caused by the coronavirus, market uncertainty will prevail in the upcoming quarters.”
Silicon Area Shipment Trends – Semiconductor Applications Only
Millions of Square Inches
| 4Q 2018 | 1Q 2019 | 2Q 2019 | 3Q 2019 | 4Q 2019 | 1Q 2020 |
Total | 3,234 | 3,051 | 2,983 | 2,932 | 2,844 | 2,920 |
Source: SEMI (www.semi.org), April 2020
All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.
Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.
A sub-committee of the SEMI Electronic Materials Group (EMG), the SMG is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.
For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.
About SEMI
SEMI® connects more than 2,260 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more,
|
Related News
- 2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
- Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports
- Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
- Second Quarter 2020 Silicon Wafer Shipments Up Over First-Quarter and Year-Ago Volumes
- Gradual Rebound or Slight Dip - Two Scenarios for COVID-19 Impact to 2020 Global Silicon Wafer Market Sales
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |