Samsung Develops Industry's First System-in-Package (SiP) with an ARM-based processor, NAND flash and SDRAM

Seoul, Korea Feb. 3, 2003 - Samsung Electronics, the world's second largest semiconductor manufacturer, today announced the industry's first System-in-Package (SiP) with an ARM-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices. This gives PDA and smartphone designers the flexibility to create a new range of cell phone designs and form factors that also support advanced features such as multimedia.

"The integration of data, voice and video in smartphones and PDA's requires higher performance, longer battery life, and increasing memory density in a sleek package," said Dr. Hyung Lae Roh, executive vice president, SOC R&D Center, Samsung Electronics. "Our SiP solution offers the world's first combination of an application processor with NAND flash, which will be the leading non-volatile storage solution for next-generation handhelds."

The SiP's small form factor, 17x17mm in size and 1.4mm high, integrates Samsung's S3C2410 ARM-based application processor, 256Mb of NAND flash memory and 256Mb of SDRAM memory. The S3C2410 is the world's first System-on-Chip (SOC) to have a NAND flash boot loader.

The S3C2410 features an ARM920T CPU core operating at 203 MHz. The chip supports major operating systems including Microsoft Windows CE, Palm OS, Symbian, and Linux.

The S3C2410 SOC offers a set of tailored peripherals for smartphones and other handheld devices that allows integrated support of features that consumers will find attractive and convenient. For example, the S3C2410 application processor includes USB host and device support to allow connectivity to a variety of other devices including PC's, printers, removable storage, and other handhelds. The processor also has SDIO support, which allows handhelds to be accessorized with upcoming SDIO protocol devices such as digital cameras, keyboards, etc.
Samsung's new SiP will be displayed in Stand D57 Hall 2, GSM World Congress Conference, held in Cannes, France, on Feb. 18th - 21st.