MoSys Opens Office in Tokyo, Japan
New Office Expands Global Presence and Supports Continued Growth in Japanese Marketplace
SUNNYVALE, CALIF. – (February 3, 2003) – MoSys, Inc. (NASDAQ: MOSY), the industry's leading provider of high-density embedded memory technology, today announced the opening of its first Japan office. Located in Tokyo, MoSys' new office will expand the company's global presence and add a point of contact for current customers and partners located in the region.
"To have a true global presence, companies must be able to provide local access and immediate availability to customers throughout the world," said Dr. Fu-Chieh Hsu, president, chairman and chief executive officer at MoSys. "We have already seen tremendous growth in our licensing business from Japan and want to further this and improve the support for our existing customers."
MoSys' Japanese office is located at Quoure Ebisu 302, 4-11-9 Ebisu, Shibuya-ku Tokyo, 150-0013, Japan. The phone number is +81-3-3441-2028, fax +81-3-3441-2029.
ABOUT MOSYS
Founded in 1991, MoSys (NASDAQ: MOSY), develops, licenses and markets innovative memory technologies for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM memory results in the technology achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes. 1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, this technology can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making it an ideal technology for embedding large memories in System on Chip (SoC) designs. MoSys' licensees have shipped more than 50 million chips incorporating 1T-SRAM embedded memory technology, demonstrating the excellent manufacturability of the technology in a wide range of silicon processes and applications. MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys' website at http://www.mosys.com.
Note for Editors:1T-SRAM® is a MoSys trademark registered in the U.S. Patent and Trademark Office. All other trademarks or registered trademarks are the property of their respective owners.
|
Related News
- MoSys Opens China Office and Partners with RTI Technology China Limited to Bring Local Representation for its Bandwidth Engine(R) Family of ICs to the Region
- Nordic Semiconductor opens regional sales office in Tokyo to further enhance its presence in the Japanese market and provide support for its existing local distributors
- AI Edge Inference IP Leader Expedera Opens R&D Office in India
- AI Silicon IP Provider Expedera Opens R&D Office in Singapore
- Alphawave Semi Opens Pune Office, Continues Expansion into India
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |