Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process
Plymouth, UK -- June 10, 2020 -- Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. With over a decade of experience of delivering advanced node thermal sensing solutions for the SoC community, DTS strengthens the company’s position as the go-to leaders for innovative in-chip technologies.
As geometries scale toward 5 nano-meter and below, designers are facing major challenges to provide reliable, power efficient and speed optimized chip designs. Thermal activity can be unpredictable and if not monitored carefully can cause over-heating and excessive power consumption which in turn impacts device longevity. The ability to make precise thermal measurements beside or within CPU cores, high speed interfaces or highly active circuitry has become a mandatory requirement for devices used within a range of application areas.
“We’ve seen a clear need for tighter thermal control of semiconductor devices,” said Stephen Crosher, Moortec CEO. “Multi-core architectures applied to AI, automotive, consumer and many other applications, benefiting from highly distributed sensing schemes to minimize system-level power consumption, optimize data throughput, and improve product lifetimes. We are confident that this extension to Moortec’s portfolio will enable our customers to maximize the performance of their silicon and further strengthen the long-term collaboration we have with TSMC.”
“We are pleased with the result of our cooperation with Moortec in developing this new thermal sensing solution on the most advanced TSMC N5 process,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “Our long-term partnership with Moortec will enable designers to achieve silicon success with the leading-edge solutions benefiting from the significant power and performance boost of TSMC’s newest technologies.”
Moortec is now at the forefront of providing deep insights to the mission-mode operation of many high technology products, supporting in-field telemetry, analytics and product-level optimization solutions. The DTS technology design kit was made available in early 2020 and has already been licensed to several major customers.
About Moortec
Moortec is one of the global leaders for innovative in-chip monitoring technologies and sensing fabrics. The company is dedicated to maximizing performance, optimizing power utilization, and enabling highly accurate in-chip telemetry and analytics across many sectors, including AI, Data Center, 5G & Consumer and Automotive applications.
For more information please visit https://www.moortec.com/
|
Related News
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem
- Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology
- Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies
- Analog Bits to Demonstrate Pinless PLL and Sensor IP's in TSMC N5 Process at TSMC 2022 North America Technology Symposium
- Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |