Fraunhofer IIS announces licensing program for the new MPEG-H 3D Audio Baseline Profile
Erlangen, Germany -- July 24, 2020 -- Fraunhofer IIS welcomes the release and official adoption of the MPEG-H 3D Audio Baseline Profile. The new profile was designed to exactly meet the business and technical needs of the industry.
Tailored to the needs of next generation broadcast, streaming, and high-quality immersive music delivery, the MPEG-H 3D Audio Baseline Profile is the ideal answer to industry demands, providing truly immersive experiences and unmatched advanced next-generation audio features including user interactivity and accessibility. As a subset of the existing MPEG-H 3D Audio Low Complexity Profile, it enables maximum interoperability with existing devices that have implemented that particular profile while at the same time significantly reducing the implementation and testing effort.
Taking the next step to make the new profile easily accessible and facilitate its widespread usage, Fraunhofer IIS as the major contributor to the MPEG-H 3D Audio standard is collaborating with interested industry partners on establishing a licensing program for patents essential to the MPEG-H 3D Audio Baseline Profile.
"The MPEG-H 3D Audio Baseline Profile has been designed by ISO/IEC MPEG to deliver the most convincing immersive and interactive audio consumer experience. By cutting the implementation and testing effort by up to fifty percent, while enabling at the same time support for up to 24 audio objects, the MPEG-H 3D Audio Baseline Profile is exactly meeting the industry requirements. Its streamlined set of tools also allows for an attractive licensing program," says Dr. Bernhard Grill, Director of Fraunhofer IIS.
As a driving force in the development and deployment of the MPEG-H Audio system, Fraunhofer IIS is leading the way to enable rapid adoption of the new profile, by offering a complete set of encoder and decoder software solutions as well as content production tools and extensive technical and creative support to the industry. Consumer products tested under the established MPEG-H trademark program will give end users the confidence that products are interoperable and provide the full benefits of the MPEG-H Audio system.
Further Information
Link to the official MPEG announcement: https://mpeg-standards.com/meetings/mpeg-131/
Link to the MPEG-H Trademark Program website: MPEG-H trademark program
About MPEG-H Audio
MPEG-H Audio, substantially developed by Fraunhofer IIS, is the industry’s most advanced audio system for UHD-TV and streaming. It supports both immersive sound and the ability for users to adjust elements in the audio to their preferences. MPEG-H has been on the air since 2017 on all TV networks in South Korea under the ATSC 3.0 standard. It has also been selected for new broadcast standards to be launched in China and Brazil and is the distribution format of the 360 Reality Audio ecosystem for immersive music streaming services. Fraunhofer offers MPEG-H software implementations for many popular CPU, SoC and DSP platforms. It is widely deployed today in TV sets, premium soundbars and high-end smart speakers.
|
Fraunhofer IIS Hot IP
Related News
- Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
- MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
- Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
- MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets
- Fraunhofer's MPEG-H Audio selected as the sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |