5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
Gen-Z Seeks to Share Memory, Lower Latencies
By Gary Hilson, EETimes (July 30, 2020)
Not to be confused with the demographic cohort that succeeds millennials, Gen-Z is a memory-semantic fabric architecture that’s at a point where it must better define how it fits within the greater scheme of specifications and standards, including the somewhat mature NVM Express and the emerging Compute Express Link (CXL) protocol that’s gaining traction in data centers.
Gen-Z uses memory-semantic communications to move data between memories on different components with minimal overhead, not only interconnecting memory devices, but also processors and accelerators, the latter of which are becoming increasingly popular for specific use cases — storage and artificial intelligence, for example — while taking pressure of the CPU. Ultimately, Gen-Z is about more flexibility and responsiveness when it comes to resource provisioning and sharing, allowing systems to be reconfigured as the demands of applications for different resources change.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- IntelliProp to Demo Gen-Z 1.0 Compliant IP at Flash Memory Summit 2018
- IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect
- OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement
- PLDA Announce Complete Support for CXL and Gen-Z protocols
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks