Huawei to end production of leading edge mobile chipsets
By David Manners, Electronics Weekly (August 10, 2020)
Huawei is to end production of its top-of-the- range Kirin mobile processors in September, according to Caixin Global, the Chinese state news site.
“From Sept. 15 onward, our flagship Kirin processors cannot be produced,” Richard Yu (pictured) CEO of Huawei’s consumer unit said at the recent Mate 40 launch, “our AI-powered chips also cannot be processed. This is a huge loss for us.”
The US has barred any fab which uses US manufacturing equipment from making chips for Huawei’s chip subsidiary HiSilicon.
E-mail This Article | Printer-Friendly Page |
Related News
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
- Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems
- Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X