10Gbps Multi-Link and Multi-Protocol PCIe 4.0 PHY IP for SMIC
Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums
Santa Clara, CA -- August 24, 2020 – Analog Bits, a leading provider of low-power mixed-signal IP (Intellectual Property) solutions, will be presenting two ground-breaking papers at this year’s TSMC Online Open Innovation Platform® (OIP) Ecosystem forums on August 25th.
Paper One: Case Study of AI Wafer Scale SoC from Cerebras Systems using Analog Bits Power Integrity Sensors
- High-precision, high-sensitivity, small footprint sensors which can populate wafer scale SOC effectively and economically
- Programmable, multi-threshold, cascadable sensors used to monitor all wafer level power and operations
Paper Two: Design & Integration of Complete On-die Clock Subsystem for PCIe Gen 5
- On-die PCIe clock source for highprecision, low-jitter, and small footprint
- Expanding PCIe Gen5 clock subsystem into other clocking needs, such as Ethernet
WHEN: August 25th, 2020
WHERE: Both papers are available via TSMC Online Forums, under the HPC/3DIC track
REGISTER: https://tsmc-signup.pl-marketing.biz/attendees/2020symp/na/
About Analog Bits
Founded in 1995, Analog Bits, Inc., is the leading supplier of mixedsignal IP with a reputation for easy and reliable integration into advanced SOCs. Products include precision clocking macros such as PLLs & DLLs, programmable interconnect solutions such as multi-protocol SERDES and programmable I/O’s as well as specialized Sensors. With billions of IP cores fabricated in customer silicon, from 0.35-micron to 7-nm processes, Analog Bits has an outstanding heritage of "first-time-working” with foundries and IDMs.
|
Related News
- Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes
- Analog Bits to present half-power, multi-protocol SERDES at TSMC Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |