Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
By Anton Shilov, ETimes (October 1, 2020)
At its Architecture Day last month Intel Corp. disclosed some additional details about its upcoming process technologies and how they will affect its product lineup from 2020 and onwards. Furthermore, Intel revealed its packaging technologies roadmap, which is crucial for its next-generation CPUs, GPUs, FPGAs, and other products for different market segments. Finally, the company disclosed its new chiplet ideology that promises to change the way how Intel builds its chips.
In search of new Intel
Throughout its history Intel has had multiple key building blocks that enabled its growth and prosperity: microarchitectures that offered the right balance between simplicity and performance; top-notch process technologies and production capacities; and corporate strength coupled with a well-known brand. But the world is constantly evolving and what was good enough 10 years ago is not enough for today. Intel tends to recognize strategic inflection points early enough to respond to new challenges. So, when the company realized that it needed to offer more than CPUs to stay ahead of the competition, it introduced client and server platforms in the early 2000s and acquired FPGA and various AI/ML/DL companies in the second half of 2010s to gain appropriate assets.
But getting new assets is only a part of the job for a multi-billion corporation like Intel. To fully reinvent itself for the incoming, Intel needs the right set of building blocks to make new products. This is where new process technologies come in, only this time it is not enough for Intel to have the right manufacturing nodes. The company needs to build heterogeneous multi-chip/multi-tile solutions to address new workloads. Building them requires advanced 2.5D and 3D packaging technologies. Furthermore, Intel might need to embrace third-party manufacturing technologies at a larger scale than it does today, beyond its chipsets, FPGAs, and others products (Mobileye, Movidius, etc.).
E-mail This Article | Printer-Friendly Page |
Related News
- Intel's Ambitious Process Roadmap
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
- Siemens' Calibre platform now certified for IFS' Intel 16 process technology
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards