Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
Methodics IPLM uniquely solves semiconductor development challenges, accelerating delivery
MINNEAPOLIS, Oct. 15, 2020 -- Perforce Software, a provider of solutions to enterprise teams requiring productivity, visibility, and scale along the development lifecycle, announced today the launch of Methodics IPLM 3.0. Methodics IPLM 3.0 is the next evolution of the Methodics IP lifecycle management platform. Methodics was acquired by Perforce earlier this year.
The latest version, Methodics IPLM 3.0, solves complex semiconductor development challenges by building on its industry leading traceability platform for IP and system on chip (SoC) development. The new platform will help companies manage the planning process of SoCs by allowing what-if analysis of early design prototypes and automating the delivery of an IP bill of materials (BoM) to development teams. Methodics IPLM also adds new security solutions to help companies deal with the challenges of sharing IP and addressing the security concerns around global IP leakage, which often costs companies many millions of dollars.
"Without the ability to understand where IP is being used, from designers' workspaces all the way to products being delivered, it is nearly impossible to be able to deliver solutions on time and meet product requirements," said Simon Butler, General Manager for Methodics IPLM. "Without the ability to manage not only the IP but all the metadata associated with the design, teams waste time tracking down the correct version of IP — and trying to track down where IP has been used in previous designs. This slows down delivery and leads to time-to-market delays."
The new version of Methodics IPLM goes further than any other platform to manage the BoM of design assets in a SoC. With Methodics IPLM 3.0, this capability is now extended to the planning phase of SoC design, allowing for true what-if analysis of build vs. buy vs. reuse of IP, and insight into the implications on design cost and product schedule.
"We're excited to bring these new features to market," continued Butler. "The new planning BoM functionality will help semiconductor teams accelerate design, development, and delivery by managing iterations on the project plan and delivering the execution BoM to development teams."
Additional enhancements to Methodics IPLM include improved IP analytics and performance improvements. Building on the vast metadata management layer of the IP lifecycle management platform, Methodics IPLM will allow companies to perform complex analytics such as IP cost modeling, functional safety analysis, and external threat analysis of IP functionality. Also included in the latest version of the platform are improved performance for IP sharing and distribution throughout globally distributed development teams, and the introduction of custom defined objects to facilitated the rapid prototyping and delivery of solutions.
Learn more about what's new in Methodics IPLM by visiting perforce.com.
About Perforce
Perforce powers innovation at unrivaled scale. With a portfolio of scalable DevOps solutions, we help modern enterprises overcome complex product development challenges by improving productivity, visibility, and security throughout the product lifecycle. Our portfolio includes solutions for Agile planning & ALM, API management, automated mobile & web testing, embeddable analytics, open source support, repository management, static code analysis, version control, IP lifecycle management, and more. With over 20,000 customers, Perforce is trusted by the world's leading brands to drive their business critical technology development.
|
Related News
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
- Mentor Graphics Accelerates SoC and Embedded System Delivery with a Native Embedded Software Environment for Pre- and Post-Silicon Development, Embedding QEMU, SystemC and Emulation
- Synopsys Accelerates Development of System-On-Chip Designs With Complete IP Solution for PCI Express 3.0
- Numetrics Unveils NMX-ERP 3.0, Next Generation ERP Software for Semiconductor IC Development Organizations
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |