MEMS-based Clock Generator with On-chip Temperature Compensation
Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure
5nm technology platform accelerates silicon innovation across artificial intelligence, high performance computing and 5G wireless infrastructure markets
SAN JOSE, Calif. -- Nov. 30, 2020 -- Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its 5nm ASIC device for data center and cloud infrastructure. Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications.
5nm Technology Portfolio Highlights
- High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores
- HBM2e and HBM3 protocol solution
- High bandwidth Die2Die PHY for multi-die SoC and silicon disaggregation
- High performance and high-density standard cell libraries and memory compilers
- Advanced packaging solutions including multi-chip-modules and 2.5D stacking
Benefits of 5nm ASIC Platform vs. Previous Generation
- 2x increase in on-die computation for training and inference applications
- 2x to 4x increase in memory bandwidth with HBM2e and HBM3 PHY
- 2x higher bandwidth serial links with 112-Gbps SerDes
- Up to 30% reduction in power per given work function
- System size and cost reduction with advanced packaging solutions
“Broadcom’s pioneering ASIC leverages both N5, the industry’s most advanced silicon technology, and our high-performance CoWoS integration solution to address the demanding requirements of next-generation cloud and data center applications,” said Dr. Kevin Zhang, senior vice president of business development at TSMC. “We’re excited to see the new applications Broadcom’s ASIC platform will enable, and look forward to continued partnership to empower end customers and their innovations.”
“This first-to-market 5nm ASIC extends Broadcom’s embedded SoC leadership and paves the way for new innovations across AI, HPC, 5G and hyperscale infrastructure applications,” said Frank Ostojic, senior vice president and general manager of the ASIC Product Division at Broadcom. “Our innovative IP, proven design methodology and partnership with TSMC continue to provide leadership solutions with power, performance and time to market advantage for our customers.”
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms and factory automation. For more information, go to www.broadcom.com.
|
Related News
- Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
- Cavium Announces Availability of ThunderX: Industry's First 48 Core Family of ARMv8 Workload Optimized Processors for Next Generation Data Center & Cloud Infrastructure
- Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology
- Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML
- Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
Breaking News
- 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
- Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
- Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025
Most Popular
- Alphawave IP Response to announcement from Qualcomm
- Qualcomm considers buying Alphawave Semi
- BrainChip Partners with RTX's Raytheon for AFRL Radar Contract
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |